Deformation, failure and removal mechanisms of thin film structures in abrasive machining

Kang, Cheng-Wei and Huang, Han (2017) Deformation, failure and removal mechanisms of thin film structures in abrasive machining. Advances in Manufacturing, 5 1: 1-19. doi:10.1007/s40436-016-0165-2


Author Kang, Cheng-Wei
Huang, Han
Title Deformation, failure and removal mechanisms of thin film structures in abrasive machining
Journal name Advances in Manufacturing   Check publisher's open access policy
ISSN 2195-3597
2095-3127
Publication date 2017-03-01
Sub-type Article (original research)
DOI 10.1007/s40436-016-0165-2
Open Access Status Not yet assessed
Volume 5
Issue 1
Start page 1
End page 19
Total pages 19
Place of publication Shanghai, China
Publisher Shanghai University Press
Collection year 2018
Language eng
Abstract Thin film structures are becoming increasingly more important for industrial applications such as the making of solar panels, microelectronic devices and micro systems. However, the challenges encountered in the machining of thin film structures have been a bottleneck that impedes further wide spread uses of such structures. The development of material removal processes that are capable of producing a damage free surface at high removal rates is critical for cost effective production. Such development relies highly on a comprehensive understanding of the deformation, failure and removal mechanisms of thin film structures involved in mechanical loading. In this paper, the current understanding of the deformation characteristics of thin film systems was reviewed to provide important insights into the interfacial failure under mechanical loading, with focuses on the interfacial failure mechanisms and existing problems in the machining of thin film structures. The key characterization techniques were outlined. In particular, the recent progress in the abrasive machining of a thin film multilayer structure was summarized. The potential research directions were also presented in the end of the review.
Keyword Abrasive machining
Bilayer
Deformation
Failure
Interface
Multilayer
Thin film
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
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