In situ imaging of microstructure formation in electronic interconnections

Salleh, M. A. A. Mohd, Gourlay, C. M., Xian, J. W., Belyakov, S. A., Yasuda, H., McDonald, S. D. and Nogita, K. (2017) In situ imaging of microstructure formation in electronic interconnections. Scientific Reports, 7 . doi:10.1038/srep40010

Author Salleh, M. A. A. Mohd
Gourlay, C. M.
Xian, J. W.
Belyakov, S. A.
Yasuda, H.
McDonald, S. D.
Nogita, K.
Title In situ imaging of microstructure formation in electronic interconnections
Journal name Scientific Reports   Check publisher's open access policy
ISSN 2045-2322
Publication date 2017-01-12
Sub-type Article (original research)
DOI 10.1038/srep40010
Open Access Status DOI
Volume 7
Total pages 11
Place of publication London, United Kingdom
Publisher Nature Publishing Group
Language eng
Formatted abstract
The development of microstructure during melting, reactive wetting and solidification of solder pastes on Cu-plated printed circuit boards has been studied by synchrotron radiography. Using Sn-3.0Ag-0.5Cu/Cu and Sn-0.7Cu/Cu as examples, we show that the interfacial Cu6Sn5 layer is present within 0.05 s of wetting, and explore the kinetics of flux void formation at the interface between the liquid and the Cu6Sn5 layer. Quantification of the nucleation locations and anisotropic growth kinetics of primary Cu6Sn5 crystals reveals a competition between the nucleation of Cu6Sn5 in the liquid versus growth of Cu6Sn5 from the existing Cu6Sn5 layer. Direct imaging confirms that the β-Sn nucleates at/near the Cu6Sn5 layer in Sn-3.0Ag-0.5Cu/Cu joints.
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
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Citation counts: TR Web of Science Citation Count  Cited 6 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 6 times in Scopus Article | Citations
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