Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges

Mead, James L., Lu, Mingyuan and Huang, Han (2017) Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges. Surface and Coatings Technology, 320 478-482. doi:10.1016/j.surfcoat.2016.11.069

Attached Files (Some files may be inaccessible until you login with your UQ eSpace credentials)
Name Description MIMEType Size Downloads
UQ418032_OA.pdf Full text (open access) application/pdf 1.33MB 0

Author Mead, James L.
Lu, Mingyuan
Huang, Han
Title Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges
Journal name Surface and Coatings Technology   Check publisher's open access policy
ISSN 0257-8972
1879-3347
Publication date 2017-06-25
Year available 2017
Sub-type Article (original research)
DOI 10.1016/j.surfcoat.2016.11.069
Open Access Status File (Author Post-print)
Volume 320
Start page 478
End page 482
Total pages 5
Place of publication Lausanne, Switzerland
Publisher Elsevier S.A.
Language eng
Subject 1600 Chemistry
3104 Condensed Matter Physics
3110 Surfaces and Interfaces
2508 Surfaces, Coatings and Films
2505 Materials Chemistry
Abstract The ability to produce stable delamination of thin film multilayer interfaces is a powerful tool for studying the interfacial adhesion within microsystems. In this study, a technique involving the four-point bending of microbridges was applied to initiate stable interfacial delamination within a multilayer system. Microscale pre-notched bridges with clamped-ends were machined into an Al/SiN/GaAs multilayer using focus ion beam milling. A square flat-end indenter was used to induce bending of the bridge by two contact locations. Bridge failure occurred via substrate fracture at the pre-notch, followed by crack deflection, and stable interfacial delamination of the SiN/GaAs interface. Substrate fracture and delamination were identified within the obtained load-displacement curves as a pop-in and region of linear load reduction respectively.
Keyword FIB milling
Four-point bending
Interface
Microbridge
Nanoindentation
Thin film multilayer
Q-Index Code C1
Q-Index Status Provisional Code
Grant ID FT110100557
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
HERDC Pre-Audit
 
Versions
Version Filter Type
Citation counts: TR Web of Science Citation Count  Cited 1 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 1 times in Scopus Article | Citations
Google Scholar Search Google Scholar
Created: Tue, 17 Jan 2017, 12:39:10 EST by System User on behalf of Learning and Research Services (UQ Library)