Transient two dimensional heat conduction by orthogonal collocation technique

Sangsurasak P., Mitchell D.A. and Hossain M. (1993) Transient two dimensional heat conduction by orthogonal collocation technique. International Communications in Heat and Mass Transfer, 20 4: 557-566. doi:10.1016/0735-1933(93)90067-6


Author Sangsurasak P.
Mitchell D.A.
Hossain M.
Title Transient two dimensional heat conduction by orthogonal collocation technique
Journal name International Communications in Heat and Mass Transfer   Check publisher's open access policy
ISSN 0735-1933
Publication date 1993-01-01
Sub-type Article (original research)
DOI 10.1016/0735-1933(93)90067-6
Open Access Status
Volume 20
Issue 4
Start page 557
End page 566
Total pages 10
Subject 1507 Transportation and Freight Services
2210 Mechanical Engineering
Abstract Orthogonal collocation is used to solve a simple transient two-dimensional heat transfer problem in which a cylinder cools through conduction at its ends and convection from its side. Orthogonal collocation represents a useful technique for solution of such problems and can easily be adapted to more complex problems.
Q-Index Code C1
Institutional Status Unknown

Document type: Journal Article
Sub-type: Article (original research)
Collection: Scopus Import - Archived
 
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Created: Tue, 06 Sep 2016, 10:53:11 EST by System User