Mixed-dimensional elements in transient thermal analysis of gradient coils

Freschi, Fabio, Lopez, Hector Sanchez, Smith, Elliot, Tang, Fangfang, Repetto, Maurizio and Crozier, Stuart (2016) Mixed-dimensional elements in transient thermal analysis of gradient coils. Numerical Heat Transfer; Part A: Applications, 69 3: 265-282. doi:10.1080/10407782.2015.1080571


Author Freschi, Fabio
Lopez, Hector Sanchez
Smith, Elliot
Tang, Fangfang
Repetto, Maurizio
Crozier, Stuart
Title Mixed-dimensional elements in transient thermal analysis of gradient coils
Journal name Numerical Heat Transfer; Part A: Applications   Check publisher's open access policy
ISSN 1521-0634
1040-7782
Publication date 2016-01-01
Year available 2015
Sub-type Article (original research)
DOI 10.1080/10407782.2015.1080571
Open Access Status Not Open Access
Volume 69
Issue 3
Start page 265
End page 282
Total pages 18
Place of publication New York, NY, United States
Publisher Taylor and Francis
Language eng
Subject 2612 Numerical Analysis
3104 Condensed Matter Physics
Abstract This article proposes a numerical formulation for handling mixed-dimensional elements embedded in a standard three-dimensional (3d) mesh, avoiding thus the volume meshing of filaments and strips. The method is then applied to predict the temperature heating and cooling profile of gradient coils in magnetic resonance imaging. These coils are typically constructed from copper wires or tracks and embedded in an epoxy layer. It was found that the new method significantly reduces the computational time of steady-state and transient simulations, with speedups in the range of 3.5-5. The method proved to be accurate, with relative errors below 0.5% for steady-state simulations and 1.5% with respect to a complete 3d simulation.
Keyword Thermodynamics
Mechanics
Thermodynamics
Mechanics
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: Official 2016 Collection
School of Information Technology and Electrical Engineering Publications
 
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