Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy

Salleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015) Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82 136-147. doi:10.1016/j.matdes.2015.05.077


Author Salleh, M. A. A. Mohd
McDonald, S. D.
Terada, Y.
Yasuda, H.
Nogita, K.
Title Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy
Journal name Materials & Design   Check publisher's open access policy
ISSN 0261-3069
1873-4197
Publication date 2015-10-01
Sub-type Article (original research)
DOI 10.1016/j.matdes.2015.05.077
Open Access Status Not yet assessed
Volume 82
Start page 136
End page 147
Total pages 12
Place of publication Camden, London, United Kingdom
Publisher Elsevier
Language eng
Subject 2500 Materials Science
2211 Mechanics of Materials
2210 Mechanical Engineering
Abstract The use of reinforcing nano-size ceramic particulates is a promising method to improve the mechanical and thermal properties of lead-free solder materials. In addition, advanced fabrication processes routes such as microwave sintering powder metallurgy (PM) enhance properties in the fabrication of composite solders. To elucidate the mechanisms underlying the improvements in mechanical and thermal properties, Sn-Cu-Ni with TiO2 nano-composite additions, fabricated via a microwave sintering PM method, were investigated using state-of-the-art characterization techniques. Synchrotron micro-X-ray fluorescence (XRF) results detected trace Ti in the solder matrix. This was consistent with X-ray photoelectron spectroscopy (XPS) and high resolution transmission electron microscopy (HRTEM) results which indicated that nano crystals were within the Sn matrix. It is possible these nano crystal form due to the migration of Ti during the rapid high energy microwave heating. A hypothesis of improved thermal and mechanical properties of nano-composite solders is discussed based on the results and the microwave sintering PM route was discussed as a promising method for next generation lead-free solder processing.
Formatted abstract
The use of reinforcing nano-size ceramic particulates is a promising method to improve the mechanical and thermal properties of lead-free solder materials. In addition, advanced fabrication processes routes such as microwave sintering powder metallurgy (PM) enhance properties in the fabrication of composite solders. To elucidate the mechanisms underlying the improvements in mechanical and thermal properties, Sn–Cu–Ni with TiO2 nano-composite additions, fabricated via a microwave sintering PM method, were investigated using state-of-the-art characterization techniques. Synchrotron micro-X-ray fluorescence (XRF) results detected trace Ti in the solder matrix. This was consistent with X-ray photoelectron spectroscopy (XPS) and high resolution transmission electron microscopy (HRTEM) results which indicated that nano crystals were within the Sn matrix. It is possible these nano crystal form due to the migration of Ti during the rapid high energy microwave heating. A hypothesis of improved thermal and mechanical properties of nano-composite solders is discussed based on the results and the microwave sintering PM route was discussed as a promising method for next generation lead-free solder processing.
Keyword Lead-free solder
Nano-composite
Sintering
Titanium dioxide
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2016 Collection
 
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