MD simulation of nanometric cutting of copper with and without water lubrication

Chen, YunHui, Han, Huang, Fang, FengZhou and Hu, XiaoTang (2014) MD simulation of nanometric cutting of copper with and without water lubrication. Science China-Technological Sciences, 57 6: 1154-1159. doi:10.1007/s11431-014-5519-z


Author Chen, YunHui
Han, Huang
Fang, FengZhou
Hu, XiaoTang
Title MD simulation of nanometric cutting of copper with and without water lubrication
Journal name Science China-Technological Sciences
ISSN 1674-7321
1869-1900
Publication date 2014-06-01
Year available 2014
Sub-type Article (original research)
DOI 10.1007/s11431-014-5519-z
Open Access Status Not yet assessed
Volume 57
Issue 6
Start page 1154
End page 1159
Total pages 6
Place of publication Beijing, China
Publisher Science in China Press
Language eng
Abstract Three-dimensional molecular dynamics (MD) simulation was carried out to understand the mechanism of water lubrication in nanometric cutting. The water-lubricated cutting was compared with the dry cutting process in terms of lattice deformation, cutting force, heat and pressure distribution, and machined surface integrity. It was found that water molecules effectively reduce the friction between the tool and workpiece, the heat in the cutting zone and the pressure being generated on the tool surface, thus leading to prolonged tool life. Water molecules also enlarged the pressure-affected area, which decreased the roughness of the machined surface.
Keyword Molecular dynamics
cutting tools
Molecular dynamics simulation
Single crystal silicon
Indentation
Q-Index Code C1
Q-Index Status Confirmed Code
Grant ID 90923038
2011CB706703
B07014
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2015 Collection
 
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