Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014) Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54 20-27. doi:10.1016/j.intermet.2014.05.004


Author Zeng, Guang
McDonald, Stuart D.
Mu, Dekui
Terada, Yasuko
Yasuda, Hideyuki
Gu, Qinfen
Nogita, Kazuhiro
Title Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints
Formatted title
Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints
Journal name Intermetallics   Check publisher's open access policy
ISSN 0966-9795
1879-0216
Publication date 2014-11-01
Sub-type Article (original research)
DOI 10.1016/j.intermet.2014.05.004
Open Access Status
Volume 54
Start page 20
End page 27
Total pages 8
Place of publication Camden, London, United Kingdom
Publisher Elsevier
Language eng
Subject 1600 Chemistry
2211 Mechanics of Materials
2210 Mechanical Engineering
2506 Metals and Alloys
2505 Materials Chemistry
Abstract Ni segregation in the interfacial (Cu,Ni)Sn intermetallic layer of Sn-0.7Cu-0.05Ni/Cu BGA solder joints was investigated by using synchrotron micro X-ray fluorescence (XRF) analysis and synchrotron X-ray diffraction (XRD). Compared to Sn-0.7Cu/Cu BGA joints, Ni containing solder show suppressed CuSn growth in both reflow and annealed conditions. In as-reflowed Sn-0.7Cu-0.05Ni/Cu BGA joints, Ni was relatively homogenously distributed within interfacial (Cu,Ni)Sn. During subsequent annealing, the diffusion of Ni in CuSn was limited and it remained concentrated adjacent the Cu substrate where it contributes to the suppression of CuSn formation at the interface between the Cu substrate and CuSn intermetallics.
Formatted abstract
Highlights
• Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer was characterised.
• Ni was relatively homogenously distributed within reflowed interfacial (Cu,Ni)6Sn5.
• Ni suppressed Cu3Sn growth in both reflow and annealed conditions.

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu BGA solder joints was investigated by using synchrotron micro X-ray fluorescence (XRF) analysis and synchrotron X-ray diffraction (XRD). Compared to Sn-0.7Cu/Cu BGA joints, Ni containing solder show suppressed Cu3Sn growth in both reflow and annealed conditions. In as-reflowed Sn-0.7Cu-0.05Ni/Cu BGA joints, Ni was relatively homogenously distributed within interfacial (Cu,Ni)6Sn5. During subsequent annealing, the diffusion of Ni in Cu6Sn5 was limited and it remained concentrated adjacent the Cu substrate where it contributes to the suppression of Cu3Sn formation at the interface between the Cu substrate and Cu6Sn5 intermetallics.
Keyword D. Interfaces
D. Segregation
F. Trace element analysis
Q-Index Code C1
Q-Index Status Confirmed Code
Grant ID 24226018
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2015 Collection
 
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Created: Fri, 06 Jun 2014, 08:32:08 EST by Guang Zeng on behalf of School of Mechanical and Mining Engineering