Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Zeng, Guang, McDonald, Stuart D., Mu, Dekui, Terada, Yasuko, Yasuda, Hideyuki, Gu, Qinfen and Nogita, Kazuhiro (2014) Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. Intermetallics, 54 20-27. doi:10.1016/j.intermet.2014.05.004


Author Zeng, Guang
McDonald, Stuart D.
Mu, Dekui
Terada, Yasuko
Yasuda, Hideyuki
Gu, Qinfen
Nogita, Kazuhiro
Title Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints
Formatted title
Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints
Journal name Intermetallics   Check publisher's open access policy
ISSN 0966-9795
1879-0216
Publication date 2014-11-01
Sub-type Article (original research)
DOI 10.1016/j.intermet.2014.05.004
Volume 54
Start page 20
End page 27
Total pages 8
Place of publication Camden, London, United Kingdom
Publisher Elsevier
Language eng
Formatted abstract
Highlights
• Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer was characterised.
• Ni was relatively homogenously distributed within reflowed interfacial (Cu,Ni)6Sn5.
• Ni suppressed Cu3Sn growth in both reflow and annealed conditions.

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu BGA solder joints was investigated by using synchrotron micro X-ray fluorescence (XRF) analysis and synchrotron X-ray diffraction (XRD). Compared to Sn-0.7Cu/Cu BGA joints, Ni containing solder show suppressed Cu3Sn growth in both reflow and annealed conditions. In as-reflowed Sn-0.7Cu-0.05Ni/Cu BGA joints, Ni was relatively homogenously distributed within interfacial (Cu,Ni)6Sn5. During subsequent annealing, the diffusion of Ni in Cu6Sn5 was limited and it remained concentrated adjacent the Cu substrate where it contributes to the suppression of Cu3Sn formation at the interface between the Cu substrate and Cu6Sn5 intermetallics.
Keyword D. Interfaces
D. Segregation
F. Trace element analysis
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2015 Collection
 
Versions
Version Filter Type
Citation counts: TR Web of Science Citation Count  Cited 7 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 8 times in Scopus Article | Citations
Google Scholar Search Google Scholar
Created: Fri, 06 Jun 2014, 08:32:08 EST by Guang Zeng on behalf of School of Mechanical and Mining Engineering