Effect of intermetallic stabilization on the impact resistance of joints to BGA packages

Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. In: EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, (331-335). 9 - 11 December 2009. doi:10.1109/EPTC.2009.5416526


Author Sweatman, Keith
Suenaga, Shoichi
Miyaoka, M.
Nozu, Takashi
Nogita, Kazuhiro
Nishimura, Tetsuro
Title of paper Effect of intermetallic stabilization on the impact resistance of joints to BGA packages
Conference name 11th Electronic Packaging Technology Conference, EPTC 2009
Conference location Singapore
Conference dates 9 - 11 December 2009
Proceedings title EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Series Proceedings of the Electronic Packaging Technology Conference, EPTC
Place of Publication Piscataway, NJ United States
Publisher I E E E
Publication Year 2009
Year available 2009
Sub-type Fully published paper
DOI 10.1109/EPTC.2009.5416526
Open Access Status
ISBN 9781424451005
9781424450992
Start page 331
End page 335
Total pages 5
Language eng
Abstract/Summary To the extent that it provides a potential low energy route for crack propagation the intermetallic compound that forms at the interface between a tin-based solder and the substrate can play a critical role in determining the likelihood of joint failure in impact loading such as can occur when portable devices are accidentally dropped. While it has been clearly documented in the standard equilibrium phase diagrams the implication of the allotropic change in the Cu6Sn5 intermetallic from a closepacked hexagonal to monoclinic crystal structure at 186° C with an accompanying 2.15% increase in volume has been found to have implications for the mechanical integrity of the interfacial intermetallic that were not previously recognized. In this paper the authors report the effect of a trace addition of Ni in permanently stabilizing the high-temperature form of the Cu6Sn5 to room temperature on the response to high speed shear of Sn-0.7Cu spheres reflowed to a copper substrate. By reducing the incidence of incipient cracking in the intermetallic layer the stress required to initiate cracking and the energy required for crack propagation are significantly increased with consequent benefits for the impact resistance of the solder joint.
Subjects 2208 Electrical and Electronic Engineering
2504 Electronic, Optical and Magnetic Materials
3104 Condensed Matter Physics
Q-Index Code E1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Conference Paper
Collection: School of Mechanical & Mining Engineering Publications
 
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