Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In

Zeng, Guang, McDonald, Stuart D., Gu, Qinfen, Suenaga, Shoichi, Zhang, Yong, Chen, Jianghua and Nogita, Kazuhiro (2013) Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In. Intermetallics, 43 85-98. doi:10.1016/j.intermet.2013.07.012


Author Zeng, Guang
McDonald, Stuart D.
Gu, Qinfen
Suenaga, Shoichi
Zhang, Yong
Chen, Jianghua
Nogita, Kazuhiro
Title Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In
Formatted title
Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In
Journal name Intermetallics   Check publisher's open access policy
ISSN 0966-9795
1879-0216
Publication date 2013-12-01
Sub-type Article (original research)
DOI 10.1016/j.intermet.2013.07.012
Volume 43
Start page 85
End page 98
Total pages 14
Place of publication Camden, London, United Kingdom
Publisher Elsevier
Collection year 2014
Language eng
Formatted abstract
Highlights
• In the range of −80 °C to 240 °C, Zn, Au and In can stabilize the hexagonal Cu6Sn5.
• Zn, Au and In influence thermal expansion behaviors of Cu6Sn5.
• Hybridization plays a dominant role in the stability of hexagonal η-Cu6Sn5.

Cu6Sn5 is a critical intermetallic compound in future three-dimensional integrated circuit (3D IC) in micro-electronic packaging and has different crystal structures in the solid state. This paper investigates the effect of Zn, Au and In on the phase stability and thermal expansion behavior of Cu6Sn5 intermetallics over the temperature range of −80 °C to 240 °C, using in-situ variable temperature synchrotron powder X-ray diffraction (PXRD), dilatometry and first principles calculations. The results show Zn, Au and In stabilize the equilibrium high temperature hexagonal Cu6Sn5 crystal variant in directly alloyed samples, over the entire range of temperatures investigated. When present in hexagonal Cu6Sn5, Zn, Au and In atoms preferentially occupied specific Cu or Sn sites as leading to a more thermodynamically stable phase. The stabilization effect of Zn, Au and In was confirmed using PXRD, dilatometry and first principles calculations. The magnitude of thermal expansion and coefficients of thermal expansion (CTEs) were characterized for each addition. The stabilization of the hexagonal Cu6Sn5 structure prevented the discontinuity in volume expansion that occurs with the polymorphic transformation.
Keyword A. Intermetallics, miscellaneous
B. Phase transformation
E. Ab-initio calculations
F. Diffraction
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2014 Collection
 
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Created: Sat, 26 Oct 2013, 08:00:08 EST by Guang Zeng on behalf of School of Mechanical and Mining Engineering