Interface diffusion and morphology of aerospace grade epoxy co-cured with thermoplastic polymers

Vandi, Luigi-Jules, Hou, Meng, Veidt, Martin, Truss, Rowan W., Heitzmann, M. and Paton, R. (2012). Interface diffusion and morphology of aerospace grade epoxy co-cured with thermoplastic polymers. In: ICAS 2012 CD-ROM Proceedings. 28th International Congress of the Aeronautical Sciences (ICAS 2012), Brisbane, Australia, (1984-1992). 23-28 September 2012. doi:10.4028/www.scientific.net/AMR.393-395.184

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Author Vandi, Luigi-Jules
Hou, Meng
Veidt, Martin
Truss, Rowan W.
Heitzmann, M.
Paton, R.
Title of paper Interface diffusion and morphology of aerospace grade epoxy co-cured with thermoplastic polymers
Conference name 28th International Congress of the Aeronautical Sciences (ICAS 2012)
Conference location Brisbane, Australia
Conference dates 23-28 September 2012
Proceedings title ICAS 2012 CD-ROM Proceedings   Check publisher's open access policy
Journal name 28th Congress of the International Council of the Aeronautical Sciences 2012, ICAS 2012   Check publisher's open access policy
Place of Publication [London], U.K.
Publisher International Council of the Aeronautical Sciences (ICAS)
Publication Year 2012
Year available 2012
Sub-type Fully published paper
DOI 10.4028/www.scientific.net/AMR.393-395.184
ISBN 9780956533319
ISSN 1022-6680
Volume 3
Start page 1984
End page 1992
Total pages 9
Language eng
Formatted Abstract/Summary
Interfaces formed during the co-curing of an aerospace grade epoxy resin in contact with
PEI, PES, and PSU surfaces are examined in this work. The interface found in each scenario is characterized by optical microscopy, and low voltage Scanning Electron Microscopy (SEM) using Energy-Dispersive X-ray spectroscopy (EDX) where applicable. Atomic Force Microscopy (AFM) in tapping mode is also used for high resolution imaging of the interface. The spatial resolution and limitations for each microanalysis technique are defined, and results are interpreted accordingly.

The morphology of each interface obtained is correlated with a thermodynamic approach
based on the Hansen Solubility Parameter (HSP), which considers dispersion forces, polar forces, hydrogen bonding, and ionic forces between the two materials. The limitations of the HSP thermodynamic approach for this study are discussed.

Significant interdiffusion of more than 50μm is found with PES, PEI and PSU.
Nevertheless, a phase separation mechanism was evidenced only for PEI and PSU, and could not be detected with PES. Larger interdiffusion was observed with PSU than PEI.
Keyword Epoxy
Thermoplastic
Interface
Characterization
Sem-edx
Q-Index Code EX
Q-Index Status Confirmed Code
Institutional Status UQ
Additional Notes Paper ICAS2012-7.8.2

Document type: Conference Paper
Sub-type: Biotechnology, Chemical and Materials Engineering, Pts 1-3
Collections: School of Mechanical & Mining Engineering Publications
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Created: Thu, 11 Apr 2013, 00:41:47 EST by Rose Clements on behalf of School of Mechanical and Mining Engineering