Kinetics of the eta-eta' transformation in Cu6Sn5

Nogita, K., Gourlay, C. M., McDonald, S. D., Wu, Y. Q., Read, J. and Gu, Q. F. (2011) Kinetics of the eta-eta' transformation in Cu6Sn5. Scripta Materialia, 65 10: 922-925. doi:10.1016/j.scriptamat.2011.07.058


Author Nogita, K.
Gourlay, C. M.
McDonald, S. D.
Wu, Y. Q.
Read, J.
Gu, Q. F.
Title Kinetics of the eta-eta' transformation in Cu6Sn5
Formatted title
Kinetics of the η-η′ Transformation in Cu6Sn5
Journal name Scripta Materialia   Check publisher's open access policy
ISSN 1359-6462
1872-8456
Publication date 2011-11-01
Sub-type Article (original research)
DOI 10.1016/j.scriptamat.2011.07.058
Open Access Status Not yet assessed
Volume 65
Issue 10
Start page 922
End page 925
Total pages 4
Place of publication Kidlington, Oxford, United Kingdom
Publisher Pergamon
Language eng
Subject 2500 Materials Science
3104 Condensed Matter Physics
Abstract CuSn is an important intermetallic compound used in lead-free soldering and anode materials for Li-ion batteries. Cu Sn exists in at least two crystal structures, with a transformation from hexagonal η-CuSn at temperatures higher than ∼186 °C to monoclinic η′-CuSn at lower temperatures. Using variable temperature synchrotron X-ray diffraction analysis, the kinetics of the η-η′ transformation are investigated and a time-temperature transformation diagram is partially developed. The significance of the results in terms of phase and dimensional stability in solder joints are discussed.
Formatted abstract
Cu6Sn5 is an important intermetallic compound used in lead-free soldering and anode materials for Li-ion batteries. Cu6Sn5 exists in at least two crystal structures, with a transformation from hexagonal η-Cu6Sn5 at temperatures higher than ∼186 °C to monoclinic η′-Cu6Sn5 at lower temperatures. Using variable temperature synchrotron X-ray diffraction analysis, the kinetics of the η–η′ transformation are investigated and a time–temperature transformation diagram is partially developed. The significance of the results in terms of phase and dimensional stability in solder joints are discussed.
Keyword Intermetallic compound
Solder
Time-temperature transformation
Phase transformation
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2012 Collection
 
Versions
Version Filter Type
Citation counts: TR Web of Science Citation Count  Cited 34 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 37 times in Scopus Article | Citations
Google Scholar Search Google Scholar
Created: Sun, 13 Nov 2011, 15:45:58 EST by System User on behalf of School of Mechanical and Mining Engineering