Solidification mechanisms in the Sn-Cu-Ni lead-free solder system

Ventura, T, Cho, Y and Dahle, AK (2010). Solidification mechanisms in the Sn-Cu-Ni lead-free solder system. In: PRICM 7: Selected peer reviewed papers from the Seventh Pacific Rim International Conference on Advanced Materials and Processing. 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7, Cairns, Qld., Australia, (1381-1384). 2-6 August 2010. doi:10.4028/www.scientific.net/MSF.654-656.1381

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Author Ventura, T
Cho, Y
Dahle, AK
Title of paper Solidification mechanisms in the Sn-Cu-Ni lead-free solder system
Conference name 7th Pacific Rim International Conference on Advanced Materials and Processing, PRICM-7
Conference location Cairns, Qld., Australia
Conference dates 2-6 August 2010
Proceedings title PRICM 7: Selected peer reviewed papers from the Seventh Pacific Rim International Conference on Advanced Materials and Processing   Check publisher's open access policy
Journal name Materials Science Forum   Check publisher's open access policy
Place of Publication Stafa-Zurich, Switzerland
Publisher Trans Tech Publications
Publication Year 2010
Sub-type Fully published paper
DOI 10.4028/www.scientific.net/MSF.654-656.1381
ISBN *****************
ISSN 0255-5476
Volume 654-656
Start page 1381
End page 1384
Total pages 4
Language eng
Formatted Abstract/Summary
Pb-free solders based on near-eutectic Sn-0.7Cu-xNi alloys provide excellent solderability during wave soldering with cost advantages compared to Ag-containing alternatives. However, there is only limited knowledge of the solidification mechanisms in this alloy system and, furthermore, the ternary Sn-Cu-Ni phase diagram is not yet fully established. In this study, unidirectional solidification has been conducted in a Bridgman furnace using both binary alloys from the Sn-Cu6Sn5 system and ternary Sn-rich Sn-Cu-Ni alloys. The influence of Ni additions on the solidification mechanisms is assessed by comparing the microstructures of the ternary and binary alloys. The results are used to discuss the contrasting Sn-Cu-Ni phase diagrams reported in the literature. The results demonstrate the complex phase relations in the Sn-Cu alloy system, and the important role of trace amounts of various solute elements.
© (2010) Trans Tech Publications.
Keyword Directional solidification
Lead-free solders
Tin alloys
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

 
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Created: Fri, 25 Feb 2011, 03:21:53 EST by Dr Young-hee Cho on behalf of School of Mechanical and Mining Engineering