Comment on "The effect of evaporation on the wicking of liquids into a metallic weave" by N. Fries, K. Odic, M. Conrath and M. Dreyer

Barry, D. A., Parlange, J.-Y., Lockington, D. A. and Wissmeier, L. (2009) Comment on "The effect of evaporation on the wicking of liquids into a metallic weave" by N. Fries, K. Odic, M. Conrath and M. Dreyer. Journal of Colloid and Interface Science, 336 1: 374-375. doi:10.1016/j.jcis.2009.04.006


Author Barry, D. A.
Parlange, J.-Y.
Lockington, D. A.
Wissmeier, L.
Title Comment on "The effect of evaporation on the wicking of liquids into a metallic weave" by N. Fries, K. Odic, M. Conrath and M. Dreyer
Journal name Journal of Colloid and Interface Science   Check publisher's open access policy
ISSN 0021-9797
Publication date 2009-08-01
Sub-type Letter to editor, brief commentary or brief communication
DOI 10.1016/j.jcis.2009.04.006
Open Access Status
Volume 336
Issue 1
Start page 374
End page 375
Total pages 2
Place of publication United States
Publisher Academic Press
Language eng
Subject 2508 Surfaces, Coatings and Films
2504 Electronic, Optical and Magnetic Materials
2502 Biomaterials
1505 Colloid and Surface Chemistry
Abstract A recent paper reported capillary rise and evaporation experiments in metallic wicks, as well as a mathematical model. The authors found a consistent discrepancy between the model predictions and data: The model over-predicted the capillary height rise by about 20%. The model used assumes that the porous medium is either fully wet or dry, an assumption that is particularly unsuited to evaporation from the wick surface. An alternative variable-saturation model is proposed that provides a possible explanation for the 20% discrepancy reported by the authors.
Keyword Saturation
Flow
Q-Index Code CX
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Letter to editor, brief commentary or brief communication
Collection: School of Engineering Publications
 
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Created: Thu, 03 Sep 2009, 17:59:57 EST by Mr Andrew Martlew on behalf of School of Engineering