Nanomechanical Properties and Nanostructure of CMG and CMP Machined Si Substrates

Wang, B.L., Huang, H., Zou, J. and Zhou, L. (2008) Nanomechanical Properties and Nanostructure of CMG and CMP Machined Si Substrates. Key Engineering Materials, 381-382 525-528. doi:10.4028/www.scientific.net/KEM.381-382.525


Author Wang, B.L.
Huang, H.
Zou, J.
Zhou, L.
Title Nanomechanical Properties and Nanostructure of CMG and CMP Machined Si Substrates
Journal name Key Engineering Materials   Check publisher's open access policy
ISSN 1013-9826
ISBN *****************
Publication date 2008-02-05
Year available 2008
Sub-type Article (original research)
DOI 10.4028/www.scientific.net/KEM.381-382.525
Open Access Status Not yet assessed
Volume 381-382
Start page 525
End page 528
Total pages 3
Editor Wohlbier, F.H.
Mai, Y.W.
Place of publication Switzerland
Publisher Trans Tech Publications Ltd.
Language eng
Subject C1
069999 Biological Sciences not elsewhere classified
970102 Expanding Knowledge in the Physical Sciences
Abstract Silicon (100) substrates machined by chemo-mechanical-grinding (CMG) and chemical-mechanical-polishing (CMP) were investigated using atomic force microscopy, cross-sectional transmission electron microscopy and nanoindentation. It was found that the substrate surface after CMG was slightly better than machined by CMP in terms of roughness. The transmission electron microscopy analysis showed that the CMG-generated subsurface was defect-free, but the CMP specimen had a crystalline layer of about 4 nm in thickness on the top of the silicon lattice as evidenced by the extra diffraction spots. Nanoindentation results indicated that there exists a slight difference in mechanical properties between the CMG and CMP machined substrates.
Keyword Silicon
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

 
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Created: Wed, 08 Apr 2009, 00:01:45 EST by Rose Clements on behalf of School of Mechanical and Mining Engineering