The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys

Gourlay, C., Read, J., Nogita, K. and Dahle, A.K. (2008) The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys. Journal of Electronic Materials, 37 1: 51-60. doi:10.1007/s11664-007-0248-8


Author Gourlay, C.
Read, J.
Nogita, K.
Dahle, A.K.
Title The maximum fluidity length of solidifying Sn-Cu-Ag-Ni solder alloys
Journal name Journal of Electronic Materials   Check publisher's open access policy
ISSN 0361-5235
Publication date 2008-01-01
Year available 2008
Sub-type Article (original research)
DOI 10.1007/s11664-007-0248-8
Open Access Status
Volume 37
Issue 1
Start page 51
End page 60
Total pages 10
Editor Mahney, S.
Place of publication United States
Publisher Springer New York LLC
Language eng
Subject C1
861603 Integrated Circuits and Devices
091099 Manufacturing Engineering not elsewhere classified
Q-Index Code C1
Q-Index Status Confirmed Code

Document type: Journal Article
Sub-type: Article (original research)
Collection: 2009 Higher Education Research Data Collection
 
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Citation counts: TR Web of Science Citation Count  Cited 22 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 27 times in Scopus Article | Citations
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Created: Thu, 26 Mar 2009, 00:53:09 EST by Sally Beard on behalf of Materials