Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder

Nogita, K., Gourlay, C., Read, J., Nishimura, T., Suenaga, S. and Dahle, A.K. (2008) Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder. Materials Transactions, 49 3: 443-448. doi:10.2320/matertrans.MBW200713


Author Nogita, K.
Gourlay, C.
Read, J.
Nishimura, T.
Suenaga, S.
Dahle, A.K.
Title Effects of phosphorus on microstructure and fluidity of Sn-0.7Cu-0.05Ni lead-free solder
Journal name Materials Transactions   Check publisher's open access policy
ISSN 1345-9678
Publication date 2008-03-01
Year available 2008
Sub-type Article (original research)
DOI 10.2320/matertrans.MBW200713
Open Access Status
Volume 49
Issue 3
Start page 443
End page 448
Total pages 6
Editor Hara, N.
Place of publication Japan
Publisher Nihon Kakin Gakkai
Language eng
Subject C1
861699 Computer Hardware and Electronic Equipment not elsewhere classified
091099 Manufacturing Engineering not elsewhere classified
Q-Index Code C1
Q-Index Status Confirmed Code

Document type: Journal Article
Sub-type: Article (original research)
Collection: 2009 Higher Education Research Data Collection
 
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Citation counts: TR Web of Science Citation Count  Cited 12 times in Thomson Reuters Web of Science Article | Citations
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Created: Thu, 26 Mar 2009, 00:32:40 EST by Sally Beard on behalf of Materials