Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding

Huang, H., Wang, B. L., Wang, Y., Zou, J. and Zhou, L. (2008) Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding. Materials Science and Engineering: A, 479 1-2: 373-379. doi:10.1016/j.msea.2007.06.061

Author Huang, H.
Wang, B. L.
Wang, Y.
Zou, J.
Zhou, L.
Title Characteristics of silicon substrates fabricated using nanogrinding and chemo-mechanical-grinding
Journal name Materials Science and Engineering: A   Check publisher's open access policy
ISSN 0921-5093
Publication date 2008-04-25
Year available 2007
Sub-type Article (original research)
DOI 10.1016/j.msea.2007.06.061
Open Access Status Not yet assessed
Volume 479
Issue 1-2
Start page 373
End page 379
Total pages 7
Editor G. Kostorz
M. Kato
Place of publication Lausanne, Switzerland
Publisher Elsevier Science
Language eng
Subject C1
970102 Expanding Knowledge in the Physical Sciences
100708 Nanomaterials
0912 Materials Engineering
Abstract In this paper, the silicon substrates machined by nanogrinding and chemo-mechanical-grinding (CMG) were characterized using atomic force microscopy, transmission electron microscopy and instrumented nanomechanical tests. It was found that the nanogrinding-generated silicon subsurfaces consisted of an amorphous layer and a damaged crystalline layer underneath, but the CMG-generated subsurface was defect-free. The formation of the amorphous and damaged crystalline layers was dependent on the maximum undeformed chip thickness involved in the nanogrinding process. Nanoindentation and nanoscratch tests revealed that the amorphous silicon exhibited to be more plastically deformed than the damaged crystalline layer under the same loading condition.
Keyword CMG
Subsurface damage
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ
Additional Notes Available online 28 June 2007.

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