Browse by all authors Browse By Author/Contributor/Editor ID - Nogita, Kazuhiro

Browse Results (198 results found)

Subscribe to the RSS feed for this result setSubscribe to the RSS feed for this result set

Page 1 of 4

Result Pages:    1 2 3 4  next › last »

Refine

  Abstract Views File Downloads Thomson Reuters Web of Science Citation Count Scopus Citation Count Altmetric Score
Salleh, Mohd Arif Anuar Mohd, Al Bakri, Abdullah Mohd Mustafa, Somidin, Flora, Sandu, Andrei Victor, Saud, Norainiza, Kamaruddin, Hussin, McDonald, Stuart D. and Nogita, Kazuhiro (2013) A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods. Revista De Chimie, 64 7: 725-728.     2 Cited 3 times in Scopus3
Nogita, Kazuhiro (2011) A hydrogen storage system utilising as-cast magnesium based alloys. Ceramics Japan (Bulletin of The Ceramic Society of Japan), 46 3: 196-200.    
Nogita, K, McDonald, SD, Tsujimoto, K, Yasuda, K and Dahle, AK (2004) Aluminium phosphide as a eutectic grain nucleus in hypoeutectic Al-Si alloys. Journal of Electron Microscopy, 53 4: 361-369. doi:10.1093/jmicro/dfh048     85 Cited 94 times in Scopus94 0
Simensen, C.J., Hillion, F., Nielsen, O., Nogita, K. and Dahle, A.K. (2007). Analysis of trace elements in Na-modified Al-10 wt%Si using EMPA and NanoSIMS. In: Jones, H., Proceedings of the 5th Decennial International Conference on Solidification Processing. Solidification Processing 2007, Sheffield, United Kingdom, (244-248). 23-25 July 2007.    
Drennan, John, Webb, Rick, Nogita, Kaz, Knibbe, Ruth, Auchterlonie, Graeme, Tatenuma, K. and Hunter, Jane (2006). Analytical electron microscopy of proton exchange membrane fuel cells. In: E. Ivers-Tiffée, J. Maier and S. Singhal, Solid State Ionics 15: Proceedings of the 15th International Conference on Solid State Ionics, Part I. International Conference on Solid State Ionics, Baden-Baden, Germany, (1649-1654). 17-22 July 2005. doi:10.1016/j.ssi.2006.07.016     2 Cited 4 times in Scopus4 0
Wu, Y. Q., Barry, J., Yamamoto, T., Gu, Q. F., McDonald, S. D., Matsumura, S., Huang, H. and Nogita, K. (2012) A new phase in stoichiometric Cu6Sn5. Acta Materialia, 60 19: 6581-6591. doi:10.1016/j.actamat.2012.08.024     24 Cited 25 times in Scopus25 0
Mu, D., Huang, H. and Nogita, K. (2012) Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86 46-49. doi:10.1016/j.matlet.2012.07.018     30 Cited 31 times in Scopus31 0
Xian, J. W., Zeng, G., Belyakov, S. A., Gu, Q., Nogita, K. and Gourlay, C. M. (2017) Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and beta Sn. Intermetallics, 91 50-64. doi:10.1016/j.intermet.2017.08.002     2 Cited 4 times in Scopus4
Nogita, K., Dahle, A. K. and Drennan, J. (2001). Application of EBSD and TEM to determine eutectic solidification mechanisms. In: Japan Institute of Metals Fall Meeting, Japan, (). 21-23 Sept 2001.    
Nogita, K., Dahle, A. K. and Drennan, J. (2002). Application of SEM/EBSD and FEG-TEM/CBED to determine eutectic solidificaation mechanisms. In: John Terlet, Proc. of The 17th International Conference of Australian Society for Electron Microscopy. The 17th International Conference of Australian Society for Ey, Adelaide Convention Center, Adelaide, South Australia, (80). 4-8 February 2002.    
Prasad, Arvind, Macdonald, Stuart D., Yasuda, Hideyuki, Nogita, Kazuhiro and StJohn, David (2015) A real-time synchrotron X-ray study of primary phase nucleation and formation in hypoeutectic Al–Si alloys. Journal of Crystal Growth, 430 122-137. doi:10.1016/j.jcrysgro.2015.06.024   1 9 Cited 13 times in Scopus13 0
Gourlay, CM, Nogita, K, McDonald, SD, Nishimura, T, Sweatman, K and Dahle, AK (2006) A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu. Scripta Materialia, 54 9: 1557-1562. doi:10.1016/j.scriptamat.2006.01.025     10 Cited 17 times in Scopus17 0
Yang, Wenhui, Yamamoto, Tomokazu, Aso, Kohei, Somidin, Flora, Nogita, Kazuhiro and Matsumura, Syo (2019) Atom locations in a Ni doped η-(Cu,Ni)6Sn5 intermetallic compound. Scripta Materialia, 158 1-5. doi:10.1016/j.scriptamat.2018.08.020     0 0 2
Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. In: MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, (10-16). 1-3 July 2009.     0
Nogita, Kazuhiro, Jenke, Marc, Wood, David, Duguid, Andrew and McDonald, Stuart D. (2010). Characterisation of hydrogen release behaviour in cast Mg-Ni alloys by synchrotron XRD and XAFS. In: Jian-Feng Nie and Allan Morton, Proceedings of: PRICM 7: Selected peer reviewed papers from the Seventh Pacific Rim International Conference on Advanced Materials and Processing. 7th Pacific Rim International Conference on Advanced Materials and Processing, Cairns, Australia, (2851-2854). 2 - 6 August 2010. doi:10.4028/www.scientific.net/MSF.654-656.2851   5 1 Cited 2 times in Scopus2 0
Somidin, Flora, Maeno, Hiroshi, Mohd Salleh, M. A.A., Tran, Xuan Quy, McDonald, Stuart D., Matsumura, Syo and Nogita, Kazuhiro (2018) Characterising the polymorphic phase transformation at a localised point on a Cu6Sn5 grain. Materials Characterization, 138 113-119. doi:10.1016/j.matchar.2018.02.006     1 Cited 2 times in Scopus2
Heiberg, G., Nogita, K., Dahle, A. K. and Arnberg, L. (2002) Columnar to equiaxed transition of eutectic in hypoeutectic aluminium-silicon alloys. Acta Materialia, 50 10: 2537-2546. doi:10.1016/S1359-6454(02)00081-2     47 Cited 60 times in Scopus60 0
Lu, L, Nogita, K and Dahle, AK (2005) Combining Sr and Na additions in hypoeutectic Al-Si foundry alloys. Materials Science And Engineering A-Structural Materials Properties Microstructure And Processing, 399 1-2: 244-253. doi:10.1016/j.msea.2005.03.091     47 Cited 65 times in Scopus65 0
Henao, Hector M., Sugiyama, Akira and Nogita, Kazuhiro (2014) Comparison of solidification behavior between in situ observation and simulation of Fe-C-Si system. Journal of Alloys and Compounds, 613 132-138. doi:10.1016/j.jallcom.2014.05.184     3 Cited 4 times in Scopus4 0
Shea, Chrys, Kenny, Jim, Rasmussen, Jean, Wable, Girish, Chu, Quyen, Teng. Shiang, Sweatman, Keith and Nogita, Kazuhiro (2008) Copper erosion: The influence of metallurgy on copper dissolution: The rate of copper dissolution. Printed Circuit Design & Fab, 25 10: 35-38.     Cited 2 times in Scopus2
Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. In: ICEP 2013 Proceedings. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, (670-675). 10-12 April 2013.   13
Nogita, Kazuhiro, Gourlay, C. M and Nishimura, T (2009) Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates. JOM (A publication of The Minerals, Metals & Materials Society), 61 6: 45-51. doi:10.1007/s11837-009-0087-6     80 Cited 87 times in Scopus87 0
Mu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013) Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 2: 304-311. doi:10.1007/s11664-012-2227-y     8 Cited 15 times in Scopus15 3
Mu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016) Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 2: 55-76. doi:10.1016/j.cossms.2015.08.001     22 Cited 25 times in Scopus25 1
Une, K., Nogita, K. and Ogata, K. (2004). Crystallography of zirconium hydride in zircaloy-2 nuclear fuel cladding. In: S Crameri, M D Horne and A D Hyatt et al, Proceedings of 18th Australian Conference on Microscopy & Microanalysis. Proceedings of 18th Australian Conference on Microscopy & Microanalysis, Geelong, Australia, (42-42). 2-6 February 2004.    
Une, K, Nogita, K, Ishimoto, S and Ogata, K (2004) Crystallography of zirconium hydrides in recrystallized Zircaloy-2 fuel cladding lay electron backscatter diffraction. Journal of Nuclear Science And Technology, 41 7: 731-740. doi:10.3327/jnst.41.731     49 Cited 62 times in Scopus62 0
Xian, J. W., Belyakov, S. A., Ollivier, M., Nogita, K., Yasuda, H. and Gourlay, C. M. (2017) Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections. Acta Materialia, 126 540-551. doi:10.1016/j.actamat.2016.12.043     16 Cited 20 times in Scopus20 0
Nogita, K., Hayashi, K., Une, K. and Fukuda, K. (1999) Depth profiles of damage accumulation in UO2 and (U,Gd)O2 pellets irradiated with 100 MeV iodine. Journal of Nuclear Materials, 273 3: 302-309. doi:10.1016/S0022-3115(99)00048-3     12 Cited 12 times in Scopus12 0
Nogita, K and Dahle, AK (2001) Determination of eutectic solidification mode in Sr-modified hypoeutectic Al-Si alloys by EBSD. Materials Transactions Jim, 42 2: 207-214. doi:10.2320/matertrans.42.207     21 Cited 27 times in Scopus27 0
Nogita, K. and Dahle, A. K. (2000). Determination of eutectic solidification mode in Sr-modified hypoeutectic Al-Si alloys by EBSD. In: TMS Fall Meeting, Electron Backscatter Diffraction Symposium. TMS Fall Meeting, St Louis, MI, USA, (150-150). 3-6 October 2000.    
Nogita, K, Yasuda, H, Yoshida, K, Uesugi, K, Takeuchi, A, Suzuki, Y and Dahle, AK (2006) Determination of strontium segregation in modified hypoeutectic Al-Si alloy by micro X-ray fluorescence analysis. Scripta Materialia, 55 9: 787-790. doi:10.1016/j.scriptamat.2006.07.029     73 Cited 82 times in Scopus82 0
Wu, Y. Q., McDonald, S. D., Read, J., Huang, H. and Nogita, K. (2013) Determination of the minimum Ni concentration to prevent the η to η4+1 polymorphic transformation of stoichiometric Cu6Sn5. Scripta Materialia, 68 8: 595-598. doi:10.1016/j.scriptamat.2012.12.012     15 Cited 18 times in Scopus18 0
Salleh, M. A. A. Mohd, McDonald, S. D., Terada, Y., Yasuda, H. and Nogita, K. (2015) Development of a microwave sintered TiO2 reinforced Sn-0.7wt%Cu-0.05wt%Ni alloy. Materials & Design, 82 136-147. doi:10.1016/j.matdes.2015.05.077     9 Cited 20 times in Scopus20 0
Amano, M., Shioya, K., Arai, O., Tatenuma, K., Haraguchi, T., Drennan, J. and Nogita, K. (2003). Development of high performance anode catalyst for DMFC and DDFC (1) - Preparation and characterization of the catalyst. In: Proceedings of Annual Meeting Electrochemical Society of Japan. Proceedings of Annual Meeting Electrochemical Society of Japan, Japan, (296-296). 1-3 April 2003.    
Zeng, Guang, McDonald, Stuart and Nogita, Kazuhiro (2012) Development of high-temperature solders: Review. Microelectronics Reliability, 52 7: 1306-1322. doi:10.1016/j.microrel.2012.02.018     111 Cited 135 times in Scopus135 3
Nogita, K., Dahle, A. K., Hogan, L. M. and Drennan, J. (2000). EBSD analysis of eutectic solidification in Al-Si alloys. In: Proceedings of the 16th Australian Conference on Electron Microscopy. MicroOZcopy 2000, Canberra, Australia, (48-48). 6-11 February 2000.    
Sweatman, Keith, Nishimura, Tetsuro, McDonald, Stuary D. and Nogita, Kazuhiro (2012). Effect of cooling rate on the intermetallic layer in solder joints. In: IPC APEX Expo 2012: Proceedings. IPC APEX Expo 2012, San Diego, United States, (862-887). 28 February - 1 March 2012.    
Sweatman, K., Nishimura, T., McDonald, S. and Nogita, K. (2012) Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27 11: 68-77.     0
Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016) Effect of impurity N2 concentration on the hydriding kinetics of Na-doped Mg-Ni alloys. International Journal of Hydrogen Energy, 42 1: 366-375. doi:10.1016/j.ijhydene.2016.08.110     0 0 0
Sweatman, Keith, Suenaga, Shoichi, Miyaoka, M., Nozu, Takashi, Nogita, Kazuhiro and Nishimura, Tetsuro (2009). Effect of intermetallic stabilization on the impact resistance of joints to BGA packages. In: EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference. 11th Electronic Packaging Technology Conference, EPTC 2009, Singapore, (331-335). 9 - 11 December 2009. doi:10.1109/EPTC.2009.5416526     0 Cited 1 times in Scopus1 0
Heiberg, G., Nogita, K., Raanes, M., Dons, A. L., Dahle, A. K. and Arnberg, L. (2002) Effect of magnesium, iron and copper on eutectic solidification of hypoeutectic aluminium-silicon alloys. Transactions of the American Foundrymen's Society, 110 347-358.    
Nogita, K., Mu, D., McDonald, S. D., Read, J. and Wu, Y. Q. (2012) Effect of Ni on phase stability and thermal expansion of Cu6-xNixSn5 (X=0, 0.5, 1, 1.5 and 2). Intermetallics, 26 78-85. doi:10.1016/j.intermet.2012.03.047     36 Cited 40 times in Scopus40 0
Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015) Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 1: 154-163. doi:10.1007/s11664-015-4121-x     12 Cited 5 times in Scopus5 0
Nogita, K., Somidin, F., Mohd Salleh, M. A.A., Sweatman, K., Nishimura, T., McDonald, S. D., Maeno, H. and Matsumura, S. (2018). Effect of reflow conditions on the intermetallic layer in solder joints. In: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, Kuwana, Mie, Japan, (94-96). 17 - 21 April 2018. doi:10.23919/ICEP.2018.8374678     0
Mu, Dekui, Huang, Han and Nogita, Kazuhiro (2012). Effect of temperature on the mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. In: TMS 2012 141st Annual Meeting and Exhibition, Orlando, United States, (). 11-15 March 2012.    
Mohd Salleh, M. A A, Said, R. M., Saud, N., Yasuda, H., McDonald, S. D. and Nogita, K. (2016) Effect of TiO2 on the formation of primary and interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni solder paste during soldering. Key Engineering Materials, 700 161-169. doi:10.4028/www.scientific.net/KEM.700.161     Cited 1 times in Scopus1
Qu, Dong Dong, McDonald, Stuart D., Yasuda, Hideyuki, Ohara, Koji, Kohara, Shinji and Nogita, Kazuhiro (2018). Effect of trace elements on the liquid structure of Sn-Cu alloys investigated by high energy X-ray diffraction. In: Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir, Electronic Packaging Interconnect Technology. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan, (101-106). 1-2 November 2017. doi:10.4028/www.scientific.net/SSP.273.101     0
Tran, Xuan Quy, McDonald, Stuart D. , Gu, Qinfen, Tan, Xin Fu and Nogita, Kazuhiro (2016) Effect of trace Na additions on the hydriding kinetics of hypo-eutectic Mg-Ni alloys. International Journal of Hydrogen Energy, 42 10: 6851-6861. doi:10.1016/j.ijhydene.2016.12.007     0 0 0
Tran, Xuan Quy, McDonald, Stuart D., Gu, Qinfen, Matsumura, Syo and Nogita, Kazuhiro (2016) Effect of trace Na additions on the hydrogen absorption kinetics of Mg2Ni. Journal of Materials Research, 31 9: 1316-1327. doi:10.1557/jmr.2016.123     5 Cited 5 times in Scopus5 0
Xuan, Quy Tran, Mohd Salleh, Mohd Arif Anuar, McDonald, Stuart D. and Nogita, Kazuhiro (2018). Effect of trace phosphorus on the dross formation in tin-copper-nickel wave solder. In: Kazuhiro Nogita, Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin and Muhammad Faheem Mohd Tahir, Electronic Packaging Interconnect Technology. Electronic Packaging Interconnect Technology Symposium, EPITS 2017, Fukuoka, Japan , (9-13). 1-2 November 2017 . doi:10.4028/www.scientific.net/SSP.273.9     0

Page 1 of 4

Result Pages:    1 2 3 4  next › last »