A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu

Gourlay, CM, Nogita, K, McDonald, SD, Nishimura, T, Sweatman, K and Dahle, AK (2006) A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu. Scripta Materialia, 54 9: 1557-1562.


Author Gourlay, CM
Nogita, K
McDonald, SD
Nishimura, T
Sweatman, K
Dahle, AK
Title A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu
Journal name Scripta Materialia  (ERA 2012 Listed)    (ERA 2010 Rank A*)   Check publisher's open access policy
Publication date 2006
Sub-type Article
DOI 10.1016/j.scriptamat.2006.01.025
Volume number 54
Issue number 9
ISSN 1359-6462
Start page 1557
End page 1562
Total pages 6
Editor Horst Hahn
Place of publication Oxford
Publisher Pergamon-Elsevier Science Ltd
Collection year 2006
Language eng
Subject C1
291400 Materials Engineering
671004 Castings
Abstract The influence of trace level Ni additions on the eutectic solidification mode of Sn-0.7Cu has been studied using continuous torque experiments during solidification. The solid fraction at which resistance to paddle rotation at the thermal centre of the sample occurs is related to the spatial distribution of solid during solidification. The results indicate that a transition in solidification mode occurs in the range 0-300 ppm Ni. Growth occurs antiparallel to heat flow from near the mould walls in the Ni-free alloy, while equiaxed growth from distributed centres dominates in alloys containing at least 300 ppm Ni. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
Keyword Nanoscience & Nanotechnology
Lead-free Solder
Metallurgy & Metallurgical Engineering
Eutectic Solidification
Coherency
Soldering
Cu Eutectic Solder
Mechanical-properties
Dendrite Coherency
Alloys
Microstructure
Materials Science, Multidisciplinary
Q-Index Code C1

 
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