Analysis of the effect of transverse modes on free-space optical interconnect performance

Petrovic, Novak S., O'Brien, Christopher J. and Rakic, Aleksandar D. (2006) Analysis of the effect of transverse modes on free-space optical interconnect performance. Smart Materials and Structures, 15 1: S147-S153. doi:10.1088/0964-1726/15/1/024

Author Petrovic, Novak S.
O'Brien, Christopher J.
Rakic, Aleksandar D.
Title Analysis of the effect of transverse modes on free-space optical interconnect performance
Journal name Smart Materials and Structures   Check publisher's open access policy
ISSN 0964-1726
Publication date 2006-02-01
Sub-type Article (original research)
DOI 10.1088/0964-1726/15/1/024
Volume 15
Issue 1
Start page S147
End page S153
Total pages 7
Editor L. Faraone
V. K. Varadan
D. L. Pulfrey
Place of publication Bristol, United Kingdom
Publisher Institute of Physics Publishing
Collection year 2012
Language eng
Subject 291702 Optical and Photonic Systems
700302 Telecommunications
Abstract Vertical-cavity surface-emitting lasers (VCSELs) and microlenses can be used to implement free space optical interconnects (FSOIs) which do not suffer from the bandwidth limitations inherent in metallic interconnects. A comprehensive link equation describing the effects of both optical and electrical noise is introduced. We have evaluated FSOI performance by examining the following metrics: the space-bandwidth product (SBP), describing the density of channels and aggregate bandwidth that can be achieved, and the carrier-to-noise ratio (CNR), which represents the relative strength of the carrier signal. The mode expansion method (MEM) was used to account for the primary cause of optical noise: laser beam diffraction. While the literature commonly assumes an ideal single-mode laser beam, we consider the experimentally determined multimodal structure of a VCSEL beam in our calculations. It was found that maximum achievable interconnect length and density for a given CNR was significantly reduced when the higher order transverse modes were present in Simulations. However, the Simulations demonstrate that free-space optical interconnects are still a suitable solution for the communications bottleneck, despite the adverse effects introduced by transverse modes.
Keyword Instruments & Instrumentation
Materials Science, Multidisciplinary
Electronic Chips
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ
Additional Notes Special issue: Selected papers from the SPIE International Symposium on Microlectronics, MEMS and Nanotechnology, Perth, Australia December, 2003

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Created: Wed, 15 Aug 2007, 07:26:41 EST