Nanometric cutting of single crystal silicon surfaces modified by ion implantation

Fang, F. Z., Chen, Y. H., Zhang, X. D., Hu, X. T. and Zhang, G. X. (2011) Nanometric cutting of single crystal silicon surfaces modified by ion implantation. CIRP Annals - Manufacturing Technology, 60 1: 527-530. doi:10.1016/j.cirp.2011.03.057


Author Fang, F. Z.
Chen, Y. H.
Zhang, X. D.
Hu, X. T.
Zhang, G. X.
Title Nanometric cutting of single crystal silicon surfaces modified by ion implantation
Journal name CIRP Annals - Manufacturing Technology   Check publisher's open access policy
ISSN 0007-8506
1726-0604
Publication date 2011-01-01
Sub-type Article (original research)
DOI 10.1016/j.cirp.2011.03.057
Open Access Status Not yet assessed
Volume 60
Issue 1
Start page 527
End page 530
Total pages 4
Place of publication Amsterdam, Netherlands
Publisher Elsevier BV
Language eng
Abstract A novel method of ion implantation surface modification for cutting single crystal silicon is proposed. This method modifies the mechanical properties of the material's surface layer, which provides a possibility to reduce surface fractures, prolong tool life and increase the machining efficiency during the cutting process. The mechanism of both implantation surface modification and nanometric cutting is studied using transmission electron microscopy, Raman spectroscopy, nano-indentation and molecular dynamics simulation. Experiments including taper cutting, face turning and aspheric surface generation are conducted to verify the method. The results prove that the method is viable to fabricate complex silicon surface geometry and prolong tool life.
Keyword Cutting
Ion implantation
Silicon
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status Non-UQ

Document type: Journal Article
Sub-type: Article (original research)
Collection: School of Mechanical & Mining Engineering Publications
 
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Created: Wed, 15 Mar 2017, 16:15:29 EST by Yunhui Chen on behalf of Learning and Research Services (UQ Library)