Moisture dependent thermal modelling of power transformer

Cui, Yi, Ma, Hui, Saha, Tapan, Ekanayake, Chandima and Martin, Daniel (2016) Moisture dependent thermal modelling of power transformer. IEEE Transactions On Power Delivery, . doi:10.1109/TPWRD.2016.2569123

Author Cui, Yi
Ma, Hui
Saha, Tapan
Ekanayake, Chandima
Martin, Daniel
Title Moisture dependent thermal modelling of power transformer
Journal name IEEE Transactions On Power Delivery   Check publisher's open access policy
ISSN 0885-8977
Publication date 2016-06-01
Sub-type Article (original research)
DOI 10.1109/TPWRD.2016.2569123
Open Access Status Not Open Access
Total pages 11
Place of publication Piscataway, NJ, United States
Publisher Institute of Electrical and Electronics Engineers
Collection year 2017
Abstract Hot spot temperature (HST) is recognized as one of the key factors affecting the life expectancy of a transformer. In this study, a moisture dependent thermal model (MDTM) for estimating transformer hot spot temperature is proposed. In this model, nonlinear thermal resistance is formulated by considering both oil and cellulose (paper and pressboard) of the transformer. Especially, the effect of moisture concentration and temperature on the thermal resistance of cellulose is taken into account. The proposed MDTM is verified by using historical data including moisture-in-oil measurements, temperature measurements, and loading profiles, which were collected from two in-service power transformers, i.e. a vegetable oil-filled transformer and a mineral oil filled transformer. Comparisons between the proposed MDTM and a number of existing thermal models were performed on the basis of adequacy and accuracy metrics.
Keyword Hot spot temperature
Top oil temperature
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: HERDC Pre-Audit
School of Information Technology and Electrical Engineering Publications
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Created: Sun, 12 Jun 2016, 18:23:48 EST by Dr Hui Ma on behalf of School of Information Technol and Elec Engineering