Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys

Nogita, K., Kefford, B., Read, J. and McDonald, S. D. (2016). Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys. In: Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin, Rafiza Abd Razak and Muhammad Faheem Mohd Tahir, Advanced Materials Engineering and Technology IV. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, (53-57). 4-5 December 2015. doi:10.4028/www.scientific.net/MSF.857.53


Author Nogita, K.
Kefford, B.
Read, J.
McDonald, S. D.
Title of paper Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys
Formatted title
Suppression of Cu3Sn with Ni in high Cu containing Sn-Cu solder alloys
Conference name International Conference on Advanced Materials Engineering and Technology, ICAMET 2015
Conference location Kaohsiung, Taiwan
Conference dates 4-5 December 2015
Proceedings title Advanced Materials Engineering and Technology IV   Check publisher's open access policy
Journal name Materials Science Forum   Check publisher's open access policy
Place of Publication Pfaffikon, Switzerland
Publisher Trans Tech Publications
Publication Year 2016
Year available 2016
Sub-type Fully published paper
DOI 10.4028/www.scientific.net/MSF.857.53
Open Access Status Not Open Access
ISBN 9783035710205
ISSN 0255-5476
1662-9752
Editor Mohd Mustafa Al Bakri Abdullah
Liyana Jamaludin
Rafiza Abd Razak
Muhammad Faheem Mohd Tahir
Volume 857
Start page 53
End page 57
Total pages 5
Collection year 2017
Language eng
Formatted Abstract/Summary
This research examines the relationship between Cu and Ni concentration and the formation of primary Cu3Sn in high Cu containing Sn-Cu solder alloys. Through thermal analysis and optical microscopy, it was determined that Ni additions still have a significant effect in minimising or eliminating Cu3Sn for Cu concentrations as high as 30wt%. In addition, it is clear that a relationship exists between Cu concentration and the effect of Ni addition and the volume fraction of Cu3Sn increases as the Cu content increases. It is likely that the Ni addition has a significant effect on the interdiffusional coefficients of the diffusing species of Cu3Sn and Cu6Sn5, slowing the growth of Cu3Sn and encouraging primary Cu6Sn5 nucleation.
Keyword Cu3Sn
Cu6Sn5
High temperature solders
Solidification
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Conference Paper
Collections: School of Mechanical & Mining Engineering Publications
HERDC Pre-Audit
 
Versions
Version Filter Type
Citation counts: Scopus Citation Count Cited 0 times in Scopus Article
Google Scholar Search Google Scholar
Created: Tue, 29 Mar 2016, 01:48:18 EST by System User on behalf of Learning and Research Services (UQ Library)