Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders

Gourlay, C. M., Ma, Z. L., Xian, J. W., Belyakov, S. A., Mohd Salleh, M. A. A., Zeng, G., Yasuda, H. and Nogita, K. (2016). Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders. In: Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin, Rafiza Abd Razak and Muhammad Faheem Mohd Tahir, Advanced Materials Engineering and Technology IV. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, (44-48). 4-5 December 2015. doi:10.4028/www.scientific.net/MSF.857.44


Author Gourlay, C. M.
Ma, Z. L.
Xian, J. W.
Belyakov, S. A.
Mohd Salleh, M. A. A.
Zeng, G.
Yasuda, H.
Nogita, K.
Title of paper Solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni solders
Conference name International Conference on Advanced Materials Engineering and Technology, ICAMET 2015
Conference location Kaohsiung, Taiwan
Conference dates 4-5 December 2015
Proceedings title Advanced Materials Engineering and Technology IV   Check publisher's open access policy
Journal name Materials Science Forum   Check publisher's open access policy
Place of Publication Pfaffikon, Switzerland
Publisher Trans Tech Publications
Publication Year 2016
Year available 2016
Sub-type Fully published paper
DOI 10.4028/www.scientific.net/MSF.857.44
Open Access Status Not Open Access
ISBN 9783035710205
ISSN 0255-5476
1662-9752
Editor Mohd Mustafa Al Bakri Abdullah
Liyana Jamaludin
Rafiza Abd Razak
Muhammad Faheem Mohd Tahir
Volume 857
Start page 44
End page 48
Total pages 5
Collection year 2017
Language eng
Formatted Abstract/Summary
The solidification of Sn-3Ag-0.5Cu and Sn-0.7Cu-0.05Ni are overviewed and compared. In joints on Cu substrates, both solders begin solidification with primary Cu6Sn5 growing in the bulk liquid prior to tin nucleation. In freestanding balls and joints, SAC305 generally solidifies with a single tin nucleation event and exhibits a mutually-twinned tin grain structure. In contrast, SN100C BGA balls and joints exhibit multiple independent tin grains that grow as a columnar array in joints.
Keyword Cu6Sn5
EBSD
Intermetallics
Nucleation
Pb-free soldering
Synchrotron
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Conference Paper
Collections: School of Mechanical & Mining Engineering Publications
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