Effects of trace phosphorus in Sn-Cu-Ni wave solder dross

Nogita, K., Mohd Salleh, M. A. A., Tran, X. Q., Read, J., Smith, S. and McDonald, S. D. (2016). Effects of trace phosphorus in Sn-Cu-Ni wave solder dross. In: Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin, Rafiza Abd Razak and Muhammad Faheem Mohd Tahir, Advanced Materials Engineering and Technology IV. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, (49-52). 4-5 December 2015. doi:10.4028/www.scientific.net/MSF.857.49


Author Nogita, K.
Mohd Salleh, M. A. A.
Tran, X. Q.
Read, J.
Smith, S.
McDonald, S. D.
Title of paper Effects of trace phosphorus in Sn-Cu-Ni wave solder dross
Conference name International Conference on Advanced Materials Engineering and Technology, ICAMET 2015
Conference location Kaohsiung, Taiwan
Conference dates 4-5 December 2015
Proceedings title Advanced Materials Engineering and Technology IV   Check publisher's open access policy
Journal name Materials Science Forum   Check publisher's open access policy
Place of Publication Pfaffikon, Switzerland
Publisher Trans Tech Publications
Publication Year 2016
Year available 2016
Sub-type Fully published paper
DOI 10.4028/www.scientific.net/MSF.857.49
Open Access Status Not Open Access
ISBN 9783035710205
ISSN 0255-5476
1662-9752
Editor Mohd Mustafa Al Bakri Abdullah
Liyana Jamaludin
Rafiza Abd Razak
Muhammad Faheem Mohd Tahir
Volume 857
Start page 49
End page 52
Total pages 4
Collection year 2017
Language eng
Formatted Abstract/Summary
Phosphorus (P) is often added to wave-solder baths as an anti-oxidation agent for older generation eutectic Sn-37wt%Pb solders. For Pb-free solder alloys trace amounts of germanium (Ge) have been added successfully in Sn-0.7wt%Cu-0.05wt%Ni for anti-oxidation purposes during the wave soldering process. Despite this practice, there is little information on how P and Ge distribute in solder alloys and dross in this alloy system. In this paper, the effects of combinations of trace levels of Ge (< 100ppm) and P (< 100ppm) in Sn-Cu-Ni solder alloys and their dross has been investigated by XRD and SEM/EDS. It was found that the weight fraction of tin oxides in the dross is increased with an addition of less than 100ppm P. The dross consists on SnO oxide with Sn in samples containing Ge and no P, while SnO and SnO2 oxide are both present when P and Ge additions are made. In samples containing P, (Cu,Ni)6Sn5 and Ni-P and/or Ni-Sn-P intermetallics particles were found.
Keyword Dross
Fluidity
Intermetallics
Oxide
Wave solder
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Conference Paper
Collections: School of Mechanical & Mining Engineering Publications
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