Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications

Smith, S., Zeng, G., Read, J., McDonald, S. D. and Nogita, K. (2016). Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications. In: Mohd Mustafa Al Bakri Abdullah, Liyana Jamaludin, Rafiza Abd Razak and Muhammad Faheem Mohd Tahir, Advanced Materials Engineering and Technology IV. International Conference on Advanced Materials Engineering and Technology, ICAMET 2015, Kaohsiung, Taiwan, (58-62). 4-5 December 2015. doi:10.4028/www.scientific.net/MSF.857.58


Author Smith, S.
Zeng, G.
Read, J.
McDonald, S. D.
Nogita, K.
Title of paper Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications
Conference name International Conference on Advanced Materials Engineering and Technology, ICAMET 2015
Conference location Kaohsiung, Taiwan
Conference dates 4-5 December 2015
Proceedings title Advanced Materials Engineering and Technology IV   Check publisher's open access policy
Journal name Materials Science Forum   Check publisher's open access policy
Place of Publication Pfaffikon, Switzerland
Publisher Trans Tech Publications
Publication Year 2016
Year available 2016
Sub-type Fully published paper
DOI 10.4028/www.scientific.net/MSF.857.58
Open Access Status Not Open Access
ISBN 9783035710205
ISSN 0255-5476
1662-9752
Editor Mohd Mustafa Al Bakri Abdullah
Liyana Jamaludin
Rafiza Abd Razak
Muhammad Faheem Mohd Tahir
Volume 857
Start page 58
End page 62
Total pages 5
Collection year 2017
Language eng
Formatted Abstract/Summary
Extending the use of the Sn-Cu system to high-temperature solders poses additional challenges as the necessary high Cu content is in a region of the binary phase diagram which is dominated by the peritectic reaction and has the intermetallic compound (IMC) Cu3Sn as the primary phase, which is known to have negative effects on soldering properties. Minor additions of nickel (Ni) have been reported to suppress the formation of Cu3Sn in low Cu content Sn-Cu solder alloys though higher Cu content alloys have not been investigated. As such, the objective of this paper was to investigate the effect of more significant concentrations of Ni on the microstructure of a Sn-30wt%Cu alloy. An initial addition of 2wt%Ni greatly reduced the volume fractions of Cu3Sn and the amount of eutectic present whilst significantly increasing the volume fraction of Cu6Sn5; however, further additions of Ni had a less pronounced affect. The Sn-30wt%Cu morphology was changed from a plate-like structure to a dendritic structure by adding Ni, which would improve solder performance by decreasing the possible crack plane length.
Keyword Cu3Sn
Cu6Sn5
High temperature solders
Solidification
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Conference Paper
Collections: School of Mechanical & Mining Engineering Publications
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