Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review

Mu, D.K., McDonald, S.D., Read, J., Huang, H. and Nogita, K. (2016) Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review. Current Opinion in Solid State and Materials Science, 20 2: 55-76. doi:10.1016/j.cossms.2015.08.001


Author Mu, D.K.
McDonald, S.D.
Read, J.
Huang, H.
Nogita, K.
Title Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
Formatted title
Critical properties of Cu6Sn5 in electronic devices: Recent progress and a review
Journal name Current Opinion in Solid State and Materials Science   Check publisher's open access policy
ISSN 1359-0286
1879-0348
Publication date 2016-04
Year available 2015
Sub-type Critical review of research, literature review, critical commentary
DOI 10.1016/j.cossms.2015.08.001
Open Access Status Not Open Access
Volume 20
Issue 2
Start page 55
End page 76
Total pages 22
Place of publication Oxford, United Kingdom
Publisher Pergamon Press
Language eng
Formatted abstract
As the most common of the intermetallic compounds (IMCs) formed between Sn-based solders and Cu substrates during the packaging of integrated circuits (ICs), Cu6Sn5 is frequently involved in the fabrication of solder joints and plays an important role in the integrity of electronic devices. This is especially true for recently developed micro-bumps in 3-dimensional (3D) high-density integrated circuits (ICs), in which the volume fraction of Cu6Sn5 is significantly higher than in conventional ball grid array (BGA) or through hole pin (THP) arrangements. Recently, with the use of advanced characterization techniques, significant progress has been made in the understanding of Cu6Sn5 intermetallics in terms of their crystal structure, solidification behaviour, role in interface reactions, thermal expansion and mechanical properties. This improved understanding is of fundamental importance for the production of next generation electronic devices, however there is no existing comprehensive summary of this research available. Here, we provide a review on the properties of Cu6Sn5 with a focus on: (1) identification of crystal structure and possible phase transformations of Cu6Sn5 in real solder joints; (2) formation of Cu6Sn5 during solidification of commonly used Pb-free alloys and its influence on the final microstructure; (3) the formation and growth texture of interfacial Cu6Sn5; (4) thermal expansion and mechanical properties of Cu6Sn5 and the relationship between crystal structure and temperature. The effects of selected alloying elements that have remarkable influences on the above properties are also discussed. The aim of this paper is to identify the key factors that affect the properties of this important IMC and the relationship between these properties and the integrity of solder joints under various conditions.
Keyword Crystal structure
Cu6Sn5
Phase transformation
Soldering
Solidification
Thermo-mechanical properties
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Critical review of research, literature review, critical commentary
Collections: School of Mechanical & Mining Engineering Publications
Official 2016 Collection
 
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Citation counts: TR Web of Science Citation Count  Cited 2 times in Thomson Reuters Web of Science Article | Citations
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