Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process

Mohd Salleh, M.A.A., McDonald, S.D., Gourlay, C.M., Belyakov, S.A., Yasuda, H. and Nogita, K. (2015) Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process. Journal of Electronic Materials, 45 1: 154-163. doi:10.1007/s11664-015-4121-x


Author Mohd Salleh, M.A.A.
McDonald, S.D.
Gourlay, C.M.
Belyakov, S.A.
Yasuda, H.
Nogita, K.
Title Effect of Ni on the Formation and Growth of Primary Cu6Sn5 Intermetallics in Sn-0.7 wt.%Cu Solder Pastes on Cu Substrates During the Soldering Process
Journal name Journal of Electronic Materials   Check publisher's open access policy
ISSN 0361-5235
1543-186X
Publication date 2015-10-22
Year available 2015
Sub-type Article (original research)
DOI 10.1007/s11664-015-4121-x
Open Access Status Not yet assessed
Volume 45
Issue 1
Start page 154
End page 163
Total pages 10
Place of publication New York, United States
Publisher Springer
Collection year 2016
Language eng
Formatted abstract
This paper investigates the effect of 0.05 wt.% Ni on the formation and growth of primary Cu6Sn5 in Sn-0.7 wt.%Cu solder paste soldered on a Cu substrate, using a real-time synchrotron imaging technique. It was found that small additions of Ni significantly alter the formation and growth of the primary Cu6Sn5 intermetallics, making them small. In contrast, without Ni, primary Cu6Sn5 intermetallics tend to continue growth throughout solidification and end up much larger and coarser. The primary effect of the Ni addition appears to be in promoting the nucleation of a larger amount of small Cu6Sn5. The results provide direct evidence of the sequence of events in the reaction of Ni-containing Sn-0.7 wt.%Cu solder paste with a Cu substrate, and in particular the formation and growth of the primary Cu6Sn5 intermetallic.
Keyword Synchrotron imaging
solder paste
intermetallic
solidification
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2016 Collection
 
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