Electrochemical fabrication of large-area Au/TiO2 junctions

Tang, Jing, White, Matt, Stucky, Galen D. and McFarland, Eric W. (2003) Electrochemical fabrication of large-area Au/TiO2 junctions. Electrochemistry Communications, 5 6: 497-501. doi:10.1016/S1388-2481(03)00108-5

Author Tang, Jing
White, Matt
Stucky, Galen D.
McFarland, Eric W.
Title Electrochemical fabrication of large-area Au/TiO2 junctions
Formatted title
Electrochemical fabrication of large-area Au/TiO2 junctions
Journal name Electrochemistry Communications   Check publisher's open access policy
ISSN 1388-2481
Publication date 2003-06-01
Sub-type Article (original research)
DOI 10.1016/S1388-2481(03)00108-5
Open Access Status Not yet assessed
Volume 5
Issue 6
Start page 497
End page 501
Total pages 5
Place of publication Philadelphia, PA, United States
Publisher Elsevier
Language eng
Formatted abstract
Electrically continuous Au thin films were prepared on polycrystalline TiO2 by pulsed galvanostatic electrodeposition. Largearea electrically continuous films 10-30 nm in thickness and approximately 0.25 cm2 in area were created using a series of 5 ms bipolar current pulses. The film morphology was characterized by scanning electron microscopy (SEM) and atomic force microscopy (AFM) which showed a network of interconnected Au islands. The electrical properties of the resulting Schottky junction were also investigated and the conduction was found to deviate considerably from ideal thermionic emission. The effective barriers were higher than in Au/TiO2 junctions prepared by electron beam evaporation.
Keyword Au
Schottky barrier
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status Non-UQ

Document type: Journal Article
Sub-type: Article (original research)
Collection: School of Chemical Engineering Publications
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Citation counts: TR Web of Science Citation Count  Cited 40 times in Thomson Reuters Web of Science Article | Citations
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