New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range

Barry, J., Yamamoto, T., Gu, Q., Huang, Yang, Matsumura, S. and Nogita, Kazuhiro (2013). New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range. In: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, (). 3-7 March 2013.

Author Barry, J.
Yamamoto, T.
Gu, Q.
Huang, Yang
Matsumura, S.
Nogita, Kazuhiro
Title of paper New phase in stoichiometric Cu6Sn5 and effect of Ni addition on phase stabilization in wide temperature range
Conference name Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition
Conference location San Antonio, United States
Conference dates 3-7 March 2013
Convener The Minerals, Metals & Materials Society (TMS)
Publication Year 2013
Sub-type Oral presentation
Open Access Status
Language eng
Abstract/Summary The intermetallic compound Cu6Sn5 layer presenting at the solder-substrate interfaces is integral to micro-electronic solder reliability and a fundamental understanding of Cu6Sn5 crystallography is thus essential to the reliable manufacture and service of a large number of electronic devices. Cu6Sn5 has been shown to exist in at least four variants (η, η’, η6 and η8). A new monoclinic based structure in directly alloyed stoichiometric Cu6Sn5 was identified in our research using variable temperature synchrotron XRD and transmission electron microscopy. The new monoclinic phase is associated with a departure from the equilibrium temperature of the polymorphic monoclinic-hexagonal transformation temperature and the crystal structure was determined from electron diffraction patterns. The addition of Ni can stabilize the hexagonal η - Cu6Sn5 phase in stoichiometric sample by preventing the monoclinic-hexagonal transformation in a wide temperature range and the minimum Ni addition required for stabilisation was determined.
Q-Index Code EX
Q-Index Status Provisional Code
Institutional Status Unknown

Document type: Conference Paper
Collection: School of Mechanical & Mining Engineering Publications
 
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Created: Thu, 21 Nov 2013, 10:13:07 EST by Rose Clements on behalf of School of Mechanical and Mining Engineering