Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics

Zeng, Guang, McDonald, Stuart, Gu, Qinfen and Nogita, Kazuhiro (2013). Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics. In: Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition, San Antonio, United States, (). 3-7 March 2013.

Author Zeng, Guang
McDonald, Stuart
Gu, Qinfen
Nogita, Kazuhiro
Title of paper Effect of Zn, Au and In on the phase stability and thermal expansion of Cu6Sn5 intermetallics
Conference name Phase Stability, Phase Transformations, and Reactive Phase Formation in Electronic Materials XII - TMS 2013 142nd Annual Meeting and Exhibition
Conference location San Antonio, United States
Conference dates 3-7 March 2013
Convener The Minerals, Metals & Materials Society (TMS)
Publication Year 2013
Sub-type Oral presentation
Open Access Status
Language eng
Abstract/Summary Cu6Sn5 is a critical intermetallic compound in soldering operations. Conventional equilibrium phase diagrams show this compound is of either a hexagonal or monoclinic structure at temperatures above and below 186°C, respectively. Under non-equilibrium conditions the crystal structure is dependent on composition, temperature and processing history. The effect of Zn, Au and In on the hexagonal to monoclinic polymorphic transformation and thermal expansion behaviour in Cu6Sn5 intermetallics is investigated over the temperature range of -100-200℃, using various techniques including variable temperature synchrotron powder X-ray diffraction (PXRD), and differential scanning calorimetry (DSC).
Q-Index Code EX
Q-Index Status Provisional Code
Institutional Status Unknown

Document type: Conference Paper
Collection: School of Mechanical & Mining Engineering Publications
 
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Created: Thu, 21 Nov 2013, 10:10:19 EST by Rose Clements on behalf of School of Mechanical and Mining Engineering