Crack formation and propagation mechanisms in interfacial Cu6Sn5

Nogita, Kazuhiro, Mu, Dekui, McDonald, Stuart D., Read, Stuart D. and Sweatman, Keith (2013). Crack formation and propagation mechanisms in interfacial Cu6Sn5. In: ICEP 2013 Proceedings. ICEP 2013: International Conference on Electronic Packaging 2013, Osaka, Japan, (670-675). 10-12 April 2013.

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Name Description MIMEType Size Downloads
Author Nogita, Kazuhiro
Mu, Dekui
McDonald, Stuart D.
Read, Stuart D.
Sweatman, Keith
Title of paper Crack formation and propagation mechanisms in interfacial Cu6Sn5
Formatted title
Crack formation and propagation mechanisms in interfacial Cu6Sn5
Conference name ICEP 2013: International Conference on Electronic Packaging 2013
Conference location Osaka, Japan
Conference dates 10-12 April 2013
Convener Japan Institute of Electronics Packaging (JIEP)
Proceedings title ICEP 2013 Proceedings
Place of Publication Osaka, Japan
Publisher Japan Institute of Electronics Packaging (JIEP)
Publication Year 2013
Sub-type Fully published paper
Open Access Status
Start page 670
End page 675
Total pages 6
Collection year 2014
Language eng
Formatted Abstract/Summary
Cu6Sn5 is one of the most common intermetallic compounds (IMCs) in electronic packaging and forms during the interface reactions between most Sn-based solders and Cu substrates. This intermetallic plays a critical role in crack initiation and propagation in modern electrical devices. We have presented research on how to prevent the polymorphic transformation of Cu6Sn5 by adding trace amounts of Ni. This stabilisation minimises the volume change at the Cu6Sn5/solder interface and may be the reason Ni containing Sn-Cu lead-free solder joints display less cracking. This research reveals additional properties of Cu6Sn5 that are relevant to the integrity of solder joints relating to changes in the preferred growth direction of interfacial Cu6Sn5 and the degree of anisotropy of the mechanical properties in the presence of Ni. The significance of these properties with respect to the design and reliability of electronic devices is discussed.
Q-Index Code E1
Q-Index Status Provisional Code
Institutional Status UQ
Additional Notes Presented during Session FC4: "Interconnection-5".

Document type: Conference Paper
Collection: School of Mechanical & Mining Engineering Publications
 
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Created: Fri, 01 Nov 2013, 11:32:22 EST by Katie Gollschewski on behalf of School of Mechanical and Mining Engineering