Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes

Mu, D., Huang, H., McDonald, S. D., Read, J. and Nogita, K. (2013) Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 566 126-133. doi:10.1016/j.msea.2012.12.057


Author Mu, D.
Huang, H.
McDonald, S. D.
Read, J.
Nogita, K.
Title Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)(6)Sn-5 on diverse crystal planes
Journal name Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing   Check publisher's open access policy
ISSN 0921-5093
1873-4936
Publication date 2013-03-20
Year available 2013
Sub-type Article (original research)
DOI 10.1016/j.msea.2012.12.057
Volume 566
Start page 126
End page 133
Total pages 8
Place of publication Lausanne, Switzerland
Publisher Elsevier
Collection year 2014
Language eng
Formatted abstract
Cu6Sn5 is an important intermetallic compound (IMC) commonly formed during lead-free soldering. It is known that Cu6Sn5 exhibits significantly different thermo-mechanical deformation behaviour compared to both bulk solder alloys and their substrates. In high-density 3-D electrical packages individual solder joints may contain only a few grains of Cu6Sn5. The knowledge of the mechanical properties, creep and crack behaviour of Cu6Sn5 on different crystal planes is therefore essential to understanding the deformation of lead-free solder joints in service. In this research, the mechanical properties, creep and crack patterns on diverse crystal planes of hexagonal Cu6Sn5 and (Cu,Ni)6Sn5 were investigated using electron back scattered diffraction (EBSD), scanning electron microscopy (SEM) and nanoindentation. It was found that the mechanical properties, creep and crack patterns of hexagonal Cu6Sn5 were strongly related to the crystal orientation. The addition of Ni was found to reduce the anisotropy in hardness and the creep of Cu6Sn5 and had a significant effect on the crack patterns of Cu6Sn5
Keyword Ebsd
Nanoindentation
Mechanical properties
Orientation relationship
Anisotropy
Soldering
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2014 Collection
 
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Citation counts: TR Web of Science Citation Count  Cited 7 times in Thomson Reuters Web of Science Article | Citations
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