Characterisation of interfacial adhesion of thin film/substrate systems using indentation-induced delamination: a focused review

Lu, Mingyuan, Xie, Hongtao and Huang, Han (2013) Characterisation of interfacial adhesion of thin film/substrate systems using indentation-induced delamination: a focused review. Key Engineering Materials, 533 201-222. doi:10.4028/www.scientific.net/KEM.533.201

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Author Lu, Mingyuan
Xie, Hongtao
Huang, Han
Title Characterisation of interfacial adhesion of thin film/substrate systems using indentation-induced delamination: a focused review
Journal name Key Engineering Materials   Check publisher's open access policy
ISSN 1013-9826
ISBN 9783037855355
Publication date 2013-01
Sub-type Article (original research)
DOI 10.4028/www.scientific.net/KEM.533.201
Volume 533
Start page 201
End page 222
Total pages 22
Place of publication Stafa-Zurich, Switzerland
Publisher Trans Tech Publications
Collection year 2014
Language eng
Keyword Thin film
Bilayer
Delamination
Adhesion
Indentation
Acoustic Emission
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2014 Collection
 
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Citation counts: TR Web of Science Citation Count  Cited 4 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 5 times in Scopus Article | Citations
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Created: Sun, 28 Apr 2013, 00:31:13 EST by System User on behalf of School of Mechanical and Mining Engineering