Effect of cooling rate on the intermetallic layer in solder joints

Sweatman, K., Nishimura, T., McDonald, S. and Nogita, K. (2012) Effect of cooling rate on the intermetallic layer in solder joints. SMT Surface Mount Technology Magazine, 27 11: 68-77.

Author Sweatman, K.
Nishimura, T.
McDonald, S.
Nogita, K.
Title Effect of cooling rate on the intermetallic layer in solder joints
Journal name SMT Surface Mount Technology Magazine
ISSN 0947-0808
Publication date 2012-11
Sub-type Other
Volume 27
Issue 11
Start page 68
End page 77
Total pages 10
Place of publication Ingelheim, Germany
Publisher SMT
Language eng
Q-Index Code CX
Q-Index Status Provisional Code
Institutional Status Unknown

Document type: Journal Article
Sub-type: Other
Collection: School of Mechanical & Mining Engineering Publications
 
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Created: Fri, 22 Mar 2013, 14:34:23 EST by Rose Clements on behalf of School of Mechanical and Mining Engineering