Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures

Mu, Dekui, Huang, Han, McDonald, Stuart D. and Nogita, Kazuhiro (2013) Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures. Journal of Electronic Materials, 42 2: 304-311. doi:10.1007/s11664-012-2227-y

Author Mu, Dekui
Huang, Han
McDonald, Stuart D.
Nogita, Kazuhiro
Title Creep and mechanical properties of Cu6Sn5 and (Cu,Ni)(6)Sn-5 at elevated temperatures
Formatted title
Creep and mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 at elevated temperatures
Journal name Journal of Electronic Materials   Check publisher's open access policy
ISSN 0361-5235
Publication date 2013-02
Year available 2012
Sub-type Article (original research)
DOI 10.1007/s11664-012-2227-y
Volume 42
Issue 2
Start page 304
End page 311
Total pages 8
Place of publication New York, NY., United States
Publisher Springer
Collection year 2013
Language eng
Formatted abstract
Cu6Sn5 is the most common and important intermetallic compound (IMC) formed between Sn-based solders and Cu substrates during soldering. The Cu6Sn5 IMC exhibits significantly different thermomechanical properties from the solder alloys and the substrate. The progress of high-density three-dimensional (3D) electrical packaging technologies has led to increased operating temperatures, and interfacial Cu6Sn5 accounts for a larger volume fraction of the fine-pitch solder joints in these packages. Knowledge of creep and the mechanical behavior of Cu6Sn5 at elevated temperatures is therefore essential to understanding the deformation of a lead-free solder joint in service. In this work, the effects of temperature and Ni solubility on creep and mechanical properties of Cu6Sn5 were investigated using energy-dispersive x-ray spectroscopy and nanoindentation. The reduced modulus and hardness of Cu6Sn5 were found to decrease as temperature increased from 25°C to 150°C. The addition of Ni increased the reduced modulus and hardness of Cu6Sn5 and had different effects on the creep of Cu6Sn5 at room and elevated temperatures.
Keyword Intermetallic compounds
Nanoindentation tests
Mechanical properties
Leadfree Soldering
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2013 Collection
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Citation counts: TR Web of Science Citation Count  Cited 4 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 5 times in Scopus Article | Citations
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