Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5

Mu, D., Huang, H. and Nogita, K. (2012) Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86 : 46-49.


Author Mu, D.
Huang, H.
Nogita, K.
Title Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5
Formatted title Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5
Journal name Materials Letters   Check publisher's open access policy
ISSN 0167-577X
1873-4979
Publication date 2012-11-01
Sub-type Article (original research)
DOI 10.1016/j.matlet.2012.07.018
Volume 86
Start page 46
End page 49
Total pages 4
Place of publication Amsterdam, Netherlands
Publisher Elsevier
Collection year 2013
Language eng
Formatted abstract The mechanical reliability of solder joints is influenced by a layer of Cu6Sn5 intermetallics (IMC) present at the interface of tin-based solders/Cu substrates. We have discovered that the mechanical properties of hexagonal Cu6Sn5 are strongly related to the crystal orientation, using Electron Back Scattered Diffraction (EBSD) and nanoindentation on unidirectionally solidified Sn–4 wt% Cu with/without 0.05 wt% Ni. This fundamental discovery on the anisotropic mechanical properties of Cu6Sn5 may find practical applications in designing soldering processes to obtain preferred IMC orientations.
Keyword Solders
Nanoindentation
Electron Backscattering Diffraction (EBSD)
Intermetallics
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2013 Collection
 
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Created: Thu, 02 Aug 2012, 15:50:16 EST by Professor Han Huang on behalf of School of Mechanical and Mining Engineering