Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5

Mu, Dekui, Read, Jonathan, Yang, Yafeng and Nogita, Kazuhiro (2011) Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5. Journal of Materials Research, 26 20: 2660-2664. doi:10.1557/jmr.2011.293

Author Mu, Dekui
Read, Jonathan
Yang, Yafeng
Nogita, Kazuhiro
Title Thermal expansion of Cu6Sn5 and (Cu,Ni)(6)Sn-5
Formatted title
Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5
Journal name Journal of Materials Research   Check publisher's open access policy
ISSN 0884-2914
Publication date 2011-10-28
Sub-type Article (original research)
DOI 10.1557/jmr.2011.293
Volume 26
Issue 20
Start page 2660
End page 2664
Total pages 5
Place of publication New York, United States
Publisher Cambridge University Press
Collection year 2012
Language eng
Formatted abstract
Cu6Sn5 is a common intermetallic compound formed during electrical packaging. It has an allotropic transformation from the low-temperature monoclinic η’-Cu6Sn5 to high-temperature hexagonal η-Cu6Sn5 at equilibrium temperature 186 °C. In this research, the effects of this allotropic transformation and Ni addition on the thermal expansion of η’- and/or η-Cu6Sn5 were characterized using synchrotron x-ray diffraction and dilatometry. A volume expansion during the monoclinic to hexagonal transformation was found. The addition of Ni was found to decrease the undesirable thermal expansion by stabilizing the hexagonal Cu6Sn5 at temperatures below 186 °C and reducing the overall thermal expansion of Cu6Sn5.
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2012 Collection
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Citation counts: TR Web of Science Citation Count  Cited 19 times in Thomson Reuters Web of Science Article | Citations
Scopus Citation Count Cited 19 times in Scopus Article | Citations
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