A nanoscratch method for measuring hardness of thin films

Liu, Sheng, Huang, Han and Gu, Yuantong (2011) A nanoscratch method for measuring hardness of thin films. International Journal of Nanomanufacturing, 7 5/6: 427-435.

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Author Liu, Sheng
Huang, Han
Gu, Yuantong
Title A nanoscratch method for measuring hardness of thin films
Journal name International Journal of Nanomanufacturing  (ERA 2012 Listed)    (ERA 2010 Rank C)   Check publisher's open access policy
Publication date 2011
Sub-type Article
DOI 10.1504/IJNM.2011.043680
Volume number 7
Issue number 5/6
ISSN 1746-9392
1746-9406
Start page 427
End page 435
Total pages 9
Place of publication Geneva, Switzerland
Publisher Inderscience Publishers
Collection year 2012
Language eng
Abstract Thin solid films were extensively used in the making of solar cells, cutting tools, magnetic recording devices, etc. As a result, the accurate measurement of mechanical properties of the thin films, such as hardness and elastic modulus, was required. The thickness of thin films normally varies from tens of nanometers to several micrometers. It is thus challenging to measure their mechanical properties. In this study, a nanoscratch method was proposed for hardness measurement. A three-dimensional finite element method (3-D FEM) model was developed to validate the nanoscratch method and to understand the substrate effect during nanoscratch. Nanoindentation was also used for comparison. The nanoscratch method was demonstrated to be valuable for measuring hardness of thin solid films.
Keyword Thin films
Nanoscratch
Finite element method
3D FEM
Hardness measurement
Nanoindentation
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article
Collections: School of Mechanical & Mining Engineering Publications
Official 2012 Collection
 
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Created: Tue, 13 Dec 2011, 18:54:30 EST by Professor Han Huang on behalf of School of Mechanical and Mining Engineering