W-Cu 触头材料的微波烧结. Microwave sintering of W-Cu contact materials

郭颖利 Guo, Ying-li, 易健宏 Ti, Jian-hong, 罗述东 Luo, Shu-dong, 彭元东 Peng, Yuan-dong and 李丽娅 Li, Li-ya (2009) W-Cu 触头材料的微波烧结. Microwave sintering of W-Cu contact materials. Central South University of Technology, 40 3: 670-675.

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Name Description MIMEType Size Downloads
Author 郭颖利 Guo, Ying-li
易健宏 Ti, Jian-hong
罗述东 Luo, Shu-dong
彭元东 Peng, Yuan-dong
李丽娅 Li, Li-ya
Title W-Cu 触头材料的微波烧结. Microwave sintering of W-Cu contact materials
Translated title Microwave sintering of W-Cu contact materials
Language of Title chi
Journal name Central South University of Technology   Check publisher's open access policy
Translated journal name Journal of Central South University (Science and Technology)
Language of Journal Name chi
ISSN 1005-9784
Publication date 2009-06
Sub-type Article (original research)
Volume 40
Issue 3
Start page 670
End page 675
Total pages 6
Place of publication Changsha, China
Publisher Zhongnan Daxue
Language chi
Formatted abstract
采用微波烧结技术制备W-25Cu 触头材料,并与常规烧结进行对比。结果表明:微波烧结升温速度 快,周期短,能促进W-Cu 材料的致密化;在适当条件下,微波烧结能获得相对密度达99.8%的W-Cu 样品;微 波烧结能改善W-Cu 样品中两相分布的均匀性和W 晶粒尺寸的一致性,但引起W 晶粒的快速长大;Fe 烧结助剂 导致W-Cu 材料显微组织均匀性变差,并引起晶粒进一步粗化;微波烧结技术能够应用于W-Cu 材料的制备,在 缩短生产周期、降低生产成本方面具有潜在优势。

Microwave sintering of W-25Cu composites was presented, along with conventional sintering for a comparison. The experimental results show that microwave sintering promotes the densification of green compacts with higher heating rate and reduced sintering cycle. The sintered relative density of 99.8% can be achieved during microwave processing under appropriate conditions. In addition, microwave sintering improves the uniformity and homogenization of W grain size, and yet leads to growth of W grain. Fe sintering aid degrades the microstructure uniformity and further coarsens W grains. The present investigation demonstrates the feasibility of applying microwave sintering technique to consolidate W-Cu composites and its promising outlook in reducing production cycle and cost.
Keyword Microwave sintering
W-Cu contact materials
Densification microstructure
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status Non-UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: Faculty of Engineering, Architecture and Information Technology Publications
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Created: Wed, 26 Oct 2011, 15:50:30 EST by Viviane Victoria Crosthwaite on behalf of Faculty Of Engineering, Architecture & Info Tech