Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?

野北 和宏 [Nogita, Kazuhiro] (2010) Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?. エレクトロニクスの実装技術 (Erekutoronikusu no Jissō-Gijutsu) [Electronic Packaging Technology], 26 11: 20-26.

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Author 野北 和宏 [Nogita, Kazuhiro]
Title Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?
Formatted title
なぜNi添加したSn-Cu系鉛フリーはんだの接合界面には亀裂が少ないのか?
[Why is there less cracking when Ni is added to Sn-Cu lead-free solder joints?]
Journal name エレクトロニクスの実装技術 (Erekutoronikusu no Jissō-Gijutsu) [Electronic Packaging Technology]
ISSN 1342-2839
Publication date 2010-11-20
Sub-type Article (original research)
Volume 26
Issue 11
Start page 20
End page 26
Total pages 7
Publisher Gichoビジネスコミュニケーションズ [Gicho Business Communications ]
Collection year 2011
Language jpn
Formatted abstract
本稿では, 鉛フリーはんだ実装の現場での問題点と対策について,実例を紹介した。1)数百-数 千点の部品のフィレットとランド状態を短時間で観察判断する際の観察事例,2)ディ スクリート部品のはんだ付におけるハンダこてによるはんだ付の改善,3)バンプなど の微小ランドへのはんだ付における技術ポイント,4)金めっきランドへのハンダ付け 時の粒子飛散の問題と解決策などを紹介した。

In this paper, Problems and measures in the field of lead-free solder, the examples presented. 1) hundreds - of cases observed in a short time observing the state in determining land and thousands of parts, fillet, 2) Improvement of solder in the soldering iron by soldering parts Sukurito Di 3) and bump technology in the soldering point to the small land, 4) and introduced the problem and solution of scattering particles at gold-plated soldered to ground.
Keyword Solder
Soldering
Surface mount
Bump inspection
Lead-free solder
Q-Index Code CX
Q-Index Status Confirmed Code
Institutional Status UQ
Additional Notes Special issue: "実装工程の効率化に貢献する技術・ソリューション" [Technology Solutions that Contribute to the Efficient Implementation Process]. Published under "トレンドを探る Feel For Trend" [Exploring Trends].

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
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Created: Thu, 17 Mar 2011, 16:07:09 EST by Dr Kazuhiro Nogita on behalf of School of Mechanical and Mining Engineering