Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders

Ventura, T, Cho, YH, Kong, C and Dahle, AK (2011) Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders. Journal of Electronic Materials, 40 6: 1403-1408. doi:10.1007/s11664-010-1496-6

Author Ventura, T
Cho, YH
Kong, C
Dahle, AK
Title Formation of Intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni Solders
Journal name Journal of Electronic Materials   Check publisher's open access policy
ISSN 0361-5235
Publication date 2011-02-05
Sub-type Article (original research)
DOI 10.1007/s11664-010-1496-6
Volume 40
Issue 6
Start page 1403
End page 1408
Total pages 6
Place of publication Springer
Publisher New York, NY
Collection year 2012
Language eng
Formatted abstract
A study of the crystallography and composition of the constituent intermetallics in a binary eutectic Sn-0.9Cu and a ternary Sn-0.7Cu-0.08Ni solder alloy was carried out by systematic transmission electron microscopy. The results are analyzed and discussed in relation to the phase diagrams available in the literature. The intermetallic phases formed at different stages during solidification are present in different sizes and morphologies and also appear to exhibit different crystallographic properties and composition. The fine eutectic intermetallic in the Ni-containing alloy could not be matched with any of the known intermetallics in the ternary Sn-Cu-Ni system. © 2011 TMS.
Keyword Crystallography
Lead-free solder
Phase diagram
Sn-Cu-Ni alloy
Transmission electron microscopy (TEM)
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ
Additional Notes article in press

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2012 Collection
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Citation counts: TR Web of Science Citation Count  Cited 5 times in Thomson Reuters Web of Science Article | Citations
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Created: Thu, 24 Feb 2011, 16:59:26 EST by Dr Young-hee Cho on behalf of School of Mechanical and Mining Engineering