Trace element distribution in solder joints between Sn-based solders and Cu substrates

Nogita, K., Yasuda, H., Gourlay, C. M., Suenaga, S., Tsukamoto, H., McDonald, S. D., Takeuchi, A., Uesugi, K. and Suzuki, Y. (2010). Trace element distribution in solder joints between Sn-based solders and Cu substrates. In: Miki Mori, Proceedings of the Tenth International Conference on Electronics Packaging (ICEP 2010). International Conference on Electronics Packaging ICEP2010, Sapporo, Hokkaido, Japan, (549-554). 12-14 May 2010.

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Author Nogita, K.
Yasuda, H.
Gourlay, C. M.
Suenaga, S.
Tsukamoto, H.
McDonald, S. D.
Takeuchi, A.
Uesugi, K.
Suzuki, Y.
Title of paper Trace element distribution in solder joints between Sn-based solders and Cu substrates
Conference name International Conference on Electronics Packaging ICEP2010
Conference location Sapporo, Hokkaido, Japan
Conference dates 12-14 May 2010
Proceedings title Proceedings of the Tenth International Conference on Electronics Packaging (ICEP 2010)
Place of Publication Tokyo, Japan
Publisher Japan Institute of Electronics Packaging (JIEP)
Publication Year 2010
Sub-type Fully published paper
Editor Miki Mori
Start page 549
End page 554
Total pages 6
Collection year 2011
Language eng
Formatted Abstract/Summary
Trace element additions are increasingly being incorporated into lead-free solder compositions. This paper analyses the distribution of trace elements in solder joint when commercial purity Sn-based alloys are soldered onto Cu substrates. Analysis techniques include μ-XRF (X-ray fluorescence) mapping performed at the SPring-8 synchrotron radiation facility. The mapping results indicate that Ni is present in the Cu6Sn5 intermetallic reaction layer, and is distributed in a relatively homogeneous fashion as (Cu,Ni)6Sn5. In alloys containing trace levels of Ge (less than l00ppm), this element is comparatively concentrated within the oxide at the solder surface, and a lower concentration is distributed homogeneously in the solder matrix and the intermetallic reaction layer. In Sn-Pb alloys the Pb was found to segregate to the boundaries between adjacent Cu6Sn5 grains.
Q-Index Code E1
Q-Index Status Confirmed Code
Institutional Status UQ
Additional Notes Session FB1: "Energy and Environment"

 
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Created: Fri, 18 Feb 2011, 16:08:44 EST by Dr Kazuhiro Nogita on behalf of School of Mechanical and Mining Engineering