Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints

Nogita, Kazuhiro, Yasuda, Hideyuki, Gourlay, Christopher M., Suenaga, Shoichi, Tsukamoto, Hideaki, McDonald, Stuart D., Takeuchi, Akihisa, Uesugi, Kentaro and Suzuki, Yoshio (2010) Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints. Transactions of The Japan Institute of Electronics Packaging, 3 1: 40-46.

Attached Files (Some files may be inaccessible until you login with your UQ eSpace credentials)
Name Description MIMEType Size Downloads
Author Nogita, Kazuhiro
Yasuda, Hideyuki
Gourlay, Christopher M.
Suenaga, Shoichi
Tsukamoto, Hideaki
McDonald, Stuart D.
Takeuchi, Akihisa
Uesugi, Kentaro
Suzuki, Yoshio
Title Synchrotron micro-XRF measurements of trace element distributions in BGA type solders and solder joints
Journal name Transactions of The Japan Institute of Electronics Packaging   Check publisher's open access policy
ISSN 1883-3365
Publication date 2010
Sub-type Article (original research)
Volume 3
Issue 1
Start page 40
End page 46
Total pages 7
Place of publication Tokyo, Japan
Publisher Erekutoronikusu Jisso Gakkai
Collection year 2011
Language eng
Formatted abstract
Trace elements are increasingly being incorporated into lead-free solder compositions. This paper analyses the distribution of trace elements in solder joints when commercial purity Sn-based alloys are soldered onto Cu substrates. Analysis of techniques include µ-XRF (X-ray fluorescence) mapping performed at the Spring-8 Synchrotron radiation facility. The mapping results indicate that Ni is present in the Cu6Sn5 intermetallic reation layer, and is distributed in a relatively homogeneous fashion as (Cu,Ni)6Sn5. In alloys containing trace levels of Ge (60ppm), this element is comparatively concentrated within the oxide at the solder surface, and a lower concentration is distributed homogeneously in the solder matrix and in the intermetallic reaction layer. In Sn-Pb alloys, the Pb was found to segregate to the boundaries between adjacent Cu6Sn5 grains.
Keyword Lead-free solder
Intermetallics
Trace elements
Synchrotron micro-XRF
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: School of Mechanical & Mining Engineering Publications
Official 2011 Collection
 
Versions
Version Filter Type
Citation counts: Google Scholar Search Google Scholar
Created: Fri, 18 Feb 2011, 15:51:17 EST by Dr Kazuhiro Nogita on behalf of School of Mechanical and Mining Engineering