Wireless intrachip/interchip interconnections utilising tapered slot antennas for ultra-large-scale integration technology

Bialkowski, M. and Abbosh, A. (2010). Wireless intrachip/interchip interconnections utilising tapered slot antennas for ultra-large-scale integration technology. In: , Proceedings of the 20th Asia Pacific Microwave Conference. 20th Asia Pacific Microwave Conference, Macau, Peoples Republic of China, (1665-1671). 19-20 December, 2008.


Author Bialkowski, M.
Abbosh, A.
Title of paper Wireless intrachip/interchip interconnections utilising tapered slot antennas for ultra-large-scale integration technology
Conference Paper Type Fully Published Paper
Conference name 20th Asia Pacific Microwave Conference
DOI 10.1049/iet-map.2009.0238
Conference location Macau, Peoples Republic of China
Conference dates 19-20 December, 2008
Proceedings title Proceedings of the 20th Asia Pacific Microwave Conference  (ERA 2012 Listed)    (ERA 2010 Rank B)   Check publisher's open access policy
Journal name IET Microwaves, Antennas and Propagation  (ERA 2012 Listed)    (ERA 2010 Rank B)   Check publisher's open access policy
Place published Stevenage, Herts, UK
Publisher Institution of Engineering and Technology
Publication date 2010
Year available 2010
Volume number 4
Issue number 10
ISSN 1751-8725
Start page 1665
End page 1671
Total pages 7
Collection year 2011
Language eng
Abstract/Summary This study describes wireless intra and interchip interconnections to overcome fundamental limits of the hard-wired interconnections that create the bottleneck for any further developments in the ultra-large-scale integration (ULSI) technology. Tapered slot antennas of compact size are proposed for efficient transmission of signals within the frequency range 20-30 GHz between different pins of an ULSI chip in system-on-chip technology or between different microelectronic modules in system-in-package technology. The simulated results using full-wave electromagnetic simulations indicate the superiority of the proposed antenna compared with other designs available in the literature. The presented antennas have a differential input to cancel any noise and/or interference that may affect negatively on performance of the wireless interconnections. Moreover, they have an ultra wideband performance, which is essential for the ever-increasing demand on extremely high data rates. The simulated results show that the main method of propagation for the electromagnetic fields between the antennas of a wireless interconnection is via the silicon substrate, whereas the free-space propagation is limited in value. © 2010 The Institution of Engineering and Technology.
Keyword Frequency-divider
Inter-chip
CMOS
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Conference Paper
Sub-type: Fully Published Paper
Collections: Official 2011 Collection
School of Information Technology and Electrical Engineering Publications
 
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Created: Fri, 04 Feb 2011, 13:03:16 EST by Dr Amin Abbosh on behalf of School of Information Technol and Elec Engineering