Molecular dynamics simulation of rubbing phenomena in ultra-precision abrasive machining

Shimizu, Jun, Zhou, Li Bo, Yamamoto, Takeyuki and Huang, Han (2010). Molecular dynamics simulation of rubbing phenomena in ultra-precision abrasive machining. In: Jun Wang, Philip Mathew, Xiaoping Li, Chuanzhen Huang and Hongtao Zhu, Advances in Materials Processing IX. 9th Asia-Pacific Conference on Materials Processing, Sydney, NSW, Australia, (417-422). 7-10 June 2010. doi:10.4028/www.scientific.net/KEM.443.417

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Author Shimizu, Jun
Zhou, Li Bo
Yamamoto, Takeyuki
Huang, Han
Title of paper Molecular dynamics simulation of rubbing phenomena in ultra-precision abrasive machining
Conference name 9th Asia-Pacific Conference on Materials Processing
Conference location Sydney, NSW, Australia
Conference dates 7-10 June 2010
Convener University of New South Wales
Proceedings title Advances in Materials Processing IX   Check publisher's open access policy
Journal name Key Engineering Materials   Check publisher's open access policy
Place of Publication Aedermannsdorf, Switzerland
Publisher Trans Tech Publications
Publication Year 2010
Sub-type Fully published paper
DOI 10.4028/www.scientific.net/KEM.443.417
ISBN *****************
ISSN 1013-9826
Editor Jun Wang
Philip Mathew
Xiaoping Li
Chuanzhen Huang
Hongtao Zhu
Volume 443
Start page 417
End page 422
Total pages 6
Collection year 2011
Language eng
Abstract/Summary This study aims to clarify the friction and wear phenomena, which are of great importance in abrasive machining with atomic-scale material removal, such as polishing of magnetic disk substrates and CMP of semiconductor substrates. Various phenomena that occurred when a well-defined copper surface rubbed by an extremely fine rigid diamond abrasive, such asthe sliding without removal and the atomic-scale wear, were analyzed using a molecular dynamics model, in which the abrasive grain was connected to a three-dimensional spring and the holding rigidity of the abrasive grain was taken into account. A series of simulations using different indentation depths clarified that the one- or two-dimensional atomic-scale stick-slip phenomenon in proportion to the period of atomic arrays of workpiece surface occurred in the sliding processes without atomic removal. The results also demonstrated that the period and amplitude of the fundamental stick-slip wave varied when accompanied with atomic removal due to the increase in normal load. © (2010) Trans Tech Publications, Switzerland.
Keyword Abrasive Grain
Grinding
Molecular Dynamics (MD)
Polishing
Rubbing
Stick-Slip
Wear
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ
Additional Notes Published online June, 2010.

 
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Created: Tue, 23 Nov 2010, 23:39:59 EST by Professor Han Huang on behalf of School of Mechanical and Mining Engineering