Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints

Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. In: MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, (10-16). 1-3 July 2009.


Author Tsukamoto, Hideaki
Nishimura, T.
Suenaga, S.
McDonald, S. D.
Read, J.
Nogita, K.
Title of paper Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints
Conference name MA2009: The International Conference and Exhibition on Materials and AustCeram 2009
Conference location Gold Coast, QLD, Australia
Conference dates 1-3 July 2009
Journal name Materials Forum
Publication Year 2009
Sub-type Oral presentation
ISBN not found
ISSN 0883-2900
Volume 34
Start page 10
End page 16
Total pages 7
Language eng
Subjects 0912 Materials Engineering
Q-Index Code EX
Q-Index Status Provisional Code
Institutional Status Unknown

 
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Created: Tue, 12 Oct 2010, 12:09:39 EST by Jon Swabey on behalf of Faculty Of Engineering, Architecture & Info Tech