Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints

Tsukamoto, Hideaki, Nishimura, T., Suenaga, S., McDonald, S. D., Read, J. and Nogita, K. (2009). Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints. In: MA2009: The International Conference and Exhibition on Materials and AustCeram 2009, Gold Coast, QLD, Australia, (). 1-3 July 2009.


Author Tsukamoto, Hideaki
Nishimura, T.
Suenaga, S.
McDonald, S. D.
Read, J.
Nogita, K.
Title of paper Ball impact behavior of Sn-Cu (-Ni) lead-free solder joints
Conference Paper Type Oral Presentation
Conference name MA2009: The International Conference and Exhibition on Materials and AustCeram 2009
Conference location Gold Coast, QLD, Australia
Conference dates 1-3 July 2009
Publication date 2009
ISBN not found
Language eng
Subjects 0912 Materials Engineering
Q-Index Code EX
Q-Index Status Provisional Code
Institutional Status Unknown

Document type: Conference Paper
Sub-type: Oral Presentation
Collections: Excellence in Research Australia (ERA) - Collection
School of Mechanical & Mining Engineering Publications
 
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Created: Tue, 12 Oct 2010, 12:09:39 EST by Jon Swabey on behalf of Faculty Of Engineering, Architecture & Info Tech