An investigation on Hall-Petch relationship in electrodeposited nanocrystalline Cu-Ni-P Alloys

Sun, Haiqing and Shi, Yinong (2009) An investigation on Hall-Petch relationship in electrodeposited nanocrystalline Cu-Ni-P Alloys. 材料科学技术学报 (英文版) [Journal of Materials Science & Technology], 25 3: 347-350.


Author Sun, Haiqing
Shi, Yinong
Title An investigation on Hall-Petch relationship in electrodeposited nanocrystalline Cu-Ni-P Alloys
Journal name 材料科学技术学报 (英文版) [Journal of Materials Science & Technology]  (ERA 2012 Listed)    (ERA 2010 Rank C)   Check publisher's open access policy
Publication date 2009
Sub-type Article
Volume number 25
Issue number 3
ISSN 1005-0302
Start page 347
End page 350
Total pages 4
Place of publication Shenyang, Liaoning, China
Publisher Chinese Academy of Sciences
Language eng
Subject 0910 Manufacturing Engineering
0912 Materials Engineering
0913 Mechanical Engineering
Formatted abstract Nanocrystalline Cu-Ni-P alloys with average grain sizes of 7, 10 and 24 nm were synthesized by means of electrodeposition.The grain size dependences of tensile strength and hardness of the nanocrystalline Cu alloys were investigated.The breakdown of Hall-Perch relation was exhibited in both tensile strength and hardness.
Keyword Nanomaterials
Mechanical properties
Hardness
Q-Index Code C1
Q-Index Status Provisional Code
Institutional Status Unknown
Additional Notes Author prepress title: "An inverse Hall-Petch relationship in electrodeposited nanocrystalline Cu-Ni-P alloys".

 
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