Fabrication of multilayer microstructures using dry film resist and deep reactive ion etcher

Aljada, M. and Asthana, A. (2010) Fabrication of multilayer microstructures using dry film resist and deep reactive ion etcher. Micro and Nano Letters, 5 2: 121-124. doi:10.1049/mnl.2010.0019


Author Aljada, M.
Asthana, A.
Title Fabrication of multilayer microstructures using dry film resist and deep reactive ion etcher
Journal name Micro and Nano Letters   Check publisher's open access policy
ISSN 1750-0443
Publication date 2010-04
Sub-type Article (original research)
DOI 10.1049/mnl.2010.0019
Volume 5
Issue 2
Start page 121
End page 124
Total pages 4
Place of publication Stevenage, Herts, United Kingdom
Publisher The Institution of Engineering and Technology
Collection year 2011
Language eng
Abstract In this Letter, the authors demonstrate fabrication of multilevel microstructures using inductively coupled plasma deep reactive ion etcher (ICP-DRIE) in conjunction with dry film photoresist (DFR) as etch mask. By limiting the usage of photoresist on the layers, both the chances of introducing contamination as well as wastage of photoresist are reduced. Thus, combining DFR with DRIE in microfabricating of multilevel microstructure has the potential to significantly reduce fabrication time, cost and contamination. © 2010 The Institution of Engineering and Technology.
Keyword Micromechanical devices
Microfabrication
Lithography
Photoresist
Q-Index Code C1
Q-Index Status Confirmed Code
Institutional Status UQ

Document type: Journal Article
Sub-type: Article (original research)
Collections: Official 2011 Collection
Australian Institute for Bioengineering and Nanotechnology Publications
 
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Created: Sun, 11 Jul 2010, 00:02:53 EST